The Week In Review: Design/IoT


Tools Cadence updated its Allegro PCB product line with a new manufacturing option that accelerates manufacturing documentation and technology updates for increased efficiency, control and productivity for designers and streamlining handoff to manufacturing. The release also allows users to develop custom fabrication and assembly rules. Invionics expanded its Invio EDA development platfor... » read more

The Week In Review: Design


Tools CEVA integrated Bluetooth processing into its DSP cores. In addition to audio and video and always-on capabilities, the company is pitching the combination as an all-in-one, ultra-low-power solution for the wearable electronics market. So how big is this market opportunity? IDC predicts the wearable computing market will grow from 19.2 million units this year to 112 million units in 2... » read more

The Week In Review: Sept. 3


By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

The Week In Review: Aug. 30


By Ann Steffora Mutschler Continuing its drive towards enabling the Internet of Things (IoT), Renesas recently licensed a third Tensilica core from Cadence, this time the ConnX D2 DSP, which has acceleration packages optimized for IoT wired and wireless modem standards. Renesas previously licensed the Tensilica HiFi Audio DSP and ConnX BBE16 cores. In another deal for Cadence, Mellanox Tech... » read more

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