tag: MEMS

Automotive Foundries
By Ed Sperling - 16 Nov, 2017 - Comments: 0

The race to win a piece of the automotive electronics business has now reached the foundry level, and right now it's not clear exactly how this is going to work. This is uncharted territory for everyone. The build-out of electronics for assisted and autonomous driving is brand new. For existing cars, most of the chips being used are off-the-shelf microcontrollers, commodity MEMS sensors, and... » read more

Top Takeaways From SEMI-MSIG MEMS & Sensors Executive Congress 2017
By Paula Doe - 16 Nov, 2017 - Comments: 0

The MEMS and sensors sector has been talking about smarter, lower power devices forever, but this year’s recent SEMI-MSIG Executive Congress stressed the market drivers and the emerging technologies that look to bring those changes to the market. Ubiquitous sensing now demands lower power for its always-aware sensors to be useful, while acoustic wave and piezoelectric technologies are emer... » read more

Where MEMS Can Boldly Go Now
By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

What’s Up With MEMS?
By Paula Doe - 19 Oct, 2017 - Comments: 0

New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business. Changes needed for sensors for context awareness If digital assistants are ever going to be really useful, they’ll need some particular sensor capabilities to understand emotion, suggests Lama Nachman, head of Intel’s Anticipatory Compu... » read more

MEMS Market Shifting
By Ed Sperling - 19 Oct, 2017 - Comments: 0

The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

System Bits: Oct. 10
By Ann Mutschler - 10 Oct, 2017 - Comments: 0

Fast-moving magnetic particles for data storage According to MIT researchers, an exotic kind of magnetic behavior discovered just a few years ago holds great promise as a way of storing data — one that could overcome fundamental limits that might otherwise be signaling the end of Moore’s Law. Rather than reading and writing data one bit at a time by changing the orientation of magnetize... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 04 Oct, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Multi-Physics Combats Commoditization
By Brian Bailey - 14 Sep, 2017 - Comments: 0

The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 11 Sep, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Whither Xcerra?
By Jeff Dorsch - 11 Sep, 2017 - Comments: 0

Trade tensions between the People’s Republic of China and the Trump Administration could sink a big transaction in the automatic test equipment business. Xcerra, a supplier of semiconductor test systems, board testers, and electronic interconnects, announced in April that it had accepted an offer from Unic Capital Management, an affiliate of Sino IC Capital, to acquire the company for $10.... » read more

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