tag: MEMS

Challenges In 3D Resists
By Katherine Derbyshire - 24 Mar, 2014 - Comments: 2

3D integration straddles the line between CMOS fabs and packaging and assembly houses. Depending on the structure being fabricated, the most appropriate process might be more “CMOS-like” or more “package-like.” For example, in CMOS fabs lithography means spin-on photoresist, exposed by a high precision stepper. Inherent in this approach is an assumption that the wafer surface is flat... » read more

The Road Ahead For 2014
By Brian Bailey - 16 Jan, 2014 - Comments: 1

Semiconductor Engineering asked several thought leaders in the industry about the market drivers that are affecting their product planning operations for 2014. While almost everyone sees mobile devices continuing to be the major driver during 2014, there are some emerging areas that may start to have a larger impact. This article takes a look at some of those and the impacts they could have on ... » read more

Experts At The Table: MEMS Challenges
By Mark LaPedus - 30 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. What follows are excerpts... » read more

Experts At The Table: MEMS Challenges
By Mark LaPedus - 20 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. What follows are excerpts... » read more

Experts At The Table: MEMS Challenges
By Mark LaPedus - 13 Dec, 2013 - Comments: 1

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. SE: What’s happening... » read more

Manufacturing Bits: Dec. 10
By Mark LaPedus - 10 Dec, 2013 - Comments: 0

Space Telescopes The James Webb Space Telescope, the follow-on mission to the Hubble Space Telescope, is a large, infrared-optimized space telescope. Slated for a launch date of 2018, Webb will find the first galaxies that were formed in the early Universe. Webb is a collaboration between NASA, the European Space Agency (ESA) and the Canadian Space Agency (CSA). Webb’s measurements will ... » read more

Manufacturing Bits: Dec. 3
By Mark LaPedus - 03 Dec, 2013 - Comments: 0

Animal robots invade London The London Science Museum will premiere U-CAT, an underwater robot turtle designed to penetrate shipwrecks. In the exhibit, the museum will also showcase several robots that resemble an eel, bat, cheetah cub, tumbleweed, tuna, salamander and other creatures. Meanwhile, built by the Centre for Biorobotics at Tallinn University of Technology, U-CAT’s locomotio... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 27 Nov, 2013 - Comments: 0

Gesture sensing is a hot topic. Apple recently confirmed the acquisition of PrimeSense for a reported $360 million. PrimeSense is an Israel-based company known for its structured light technology. “Gesture sensing of 3D depth without a controller is the standard for game consoles such as Microsoft Kinect for Xbox and new PS Camera for PlayStation 4. Clearly, a future Apple TV is the logical p... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 15 Nov, 2013 - Comments: 0

Gartner says the natural life cycle of a technology-driven company is less than 10 years. “To compete in this environment, business leaders must destroy and rebuild the very businesses they helped create,” said Steve Prentice, vice president and Gartner Fellow. He cited examples of IBM Personal Systems Group, Nokia, MySpace, Kodak, Borders, HMV and other companies that have struggled or eve... » read more

Following The Yen
By Dan Tracy - 17 Oct, 2013 - Comments: 0

An examination of the installed fab capacity base in Japan shows that total capacity expansion has stalled in recent years due to the consolidation and closures of facilities. The closure and consolidation of 27 facilities between 2009 and 2012 reduced the installed fab capacity in Japan by at least 350,000 200mm equivalent wafers per month. With that said, investments continued in some industr... » read more

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