Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design

By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

FeFET Multi-Level Cells For In-Memory Computing In 28nm

By Technical Paper Link - 19 Oct, 2023 - Comments: 0

A technical paper titled “First demonstration of in-memory computing crossbar using multi-level Cell FeFET” was published by researchers at Robert Bosch, University of Stuttgart, Indian Institute of Technology Kanpur, Fraunhofer IPMS, RPTU Kaiserslautern-Landau, and Technical University of Munich. Abstract: "Advancements in AI led to the emergence of in-memory-computing architectures as a... » read more

DAC/Semicon West Wednesday

By The SE Staff - 13 Jul, 2023 - Comments: 1

Trade restrictions against China were a regular topic of discussion at both DAC and Semicon West this week. Five Chinese startups exhibited prominently at this week's Design Automation Conference, in the wake of increasingly restrictive trade regulations that limit the sale of U.S. and European EDA tools used to develop advanced semiconductors. Most attendees interviewed said privately th... » read more

What Formula 1 Racing Says About Auto’s High-Tech Future

By Marie C. Baca - 07 Jul, 2022 - Comments: 0

To learn about the future of the auto industry, you can interview analysts and experts, peruse scientific publications, and attend various conferences. Or you can watch multi-million dollar race cars hurtle around a track at speeds of upwards of 220 miles per hour. Welcome to Formula 1, the international auto racing sport with a cumulative TV audience of 1.55 billion people. The budgets are ... » read more

2021 Top Tech Videos

By Linda Christensen - 28 Dec, 2021 - Comments: 0

While the world’s chip shortage dominated the 2021 headlines, the semiconductor industry blazed new trails with the increased electrification of cars, focused AI applications, improving power/performance, better utilization of data deluges, dealing with design challenges in advanced nodes and much more focus on chip security. Semiconductor Engineering’s Tech Talks reflected these focus a... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 Nov, 2021 - Comments: 0

Automotive The U.S. Department of Energy (DOE) is funding 25 cleaner car and truck projects with $199 million. Projects include long-haul trucks powered by batteries and fuel cells, and at improving the nation’s electric vehicle (EV) charging infrastructure. The Volvo Group North America (VGNA) will receive $18 million in federal funds under DOE’s SuperTruck 3 Program. Daimler Trucks N... » read more

High-Level Synthesis For RISC-V

By Brian Bailey - 28 Oct, 2021 - Comments: 2

High-quality RISC-V implementations are becoming more numerous, but it is the extensibility of the architecture that is driving a lot of design activity. The challenge is designing and implementing custom processors without having to re-implement them every time at the register transfer level (RTL). There are two types of high-level synthesis (HLS) that need to be considered. The first is ge... » read more

Competing Auto Sensor Fusion Approaches

By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

Challenges For New AI Processor Architectures

By Brian Bailey - 29 Jul, 2021 - Comments: 0

Investment money is flooding into the development of new AI processors for the data center, but the problems here are unique, the results are unpredictable, and the competition has deep pockets and very sticky products. The biggest issue may be insufficient data about the end market. When designing a new AI processor, every design team has to answer one fundamental question — how much flex... » read more

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