tag: Mentor

Chip Industry Week In Review
By The SE Staff - 09 Feb, 2024 - Comments: 0

By Jesse Allen, Linda Christensen, and Liz Allan.  The Biden administration plans to invest more than $5B  for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Blog Review: Feb. 7
By Jesse Allen - 07 Feb, 2024 - Comments: 0

Synopsys' Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems. Siemens' John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lin... » read more

Software-Defined Vehicles Ready To Roll
By Ann Mutschler - 05 Feb, 2024 - Comments: 0

Software-defined vehicles are driving a swell of activity across the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features. The SDV approach encompasses more than a single concept. It helps to think of it more as a modeling approach that connects EVs, driver assistance technology, and... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Dealing With Noise In Image Sensors
By Karen Heyman - 01 Feb, 2024 - Comments: 0

The expanding use and importance of image sensors in safety-critical applications such as automotive and medical devices has transformed noise from an annoyance into a life-threatening problem that requires a real-time solution. In consumer cameras, noise typically results in grainy images, often associated with poor lighting, the speed at which an image is captured, or a faulty sensor. Typi... » read more

Role For ICs Expands In Humanoid Robots
By John Koon - 01 Feb, 2024 - Comments: 0

Semiconductors play a crucial role in the development and functionality of humanoid robots. Humanoid robots are advanced machines designed to resemble and perform tasks similar to humans. The integration of semiconductors in humanoid robots contributes to their sensory perception, processing capabilities, and overall functionality. Robots are used in everything from security and defense, to ... » read more

Formal Verification’s Usefulness Widens
By Ann Mutschler - 31 Jan, 2024 - Comments: 0

Formal verification is being deployed more often and in more places in chip designs as the number of possible interactions grows, and as those chips are used in more critical applications. In the past, much of formal verification was focused on whether a chip would function properly. But as designs become more complex and heterogeneous, and as use cases change, formal verification is being u... » read more

Blog Review: Jan. 31
By Jesse Allen - 31 Jan, 2024 - Comments: 0

Synopsys' William Ruby argues for a comprehensive energy-efficient design methodology for automotive ICs as today's vehicles demand ever more computing power to support electrification, communication, and processing of massive amounts of data. Cadence's Mellacheruvu Srikanth finds that verifying all the new features and enhancements across several generations of PCIe while maintaining backwa... » read more

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy