Blog Review: May 24


Siemens' Patrick McGoff finds that designers have not had easy tools to address solderability, leaving a critical part of the manufacturing success of a PCB to the component engineer or the contract manufacturer, and points to manufacturing-driven design as a way to avoid quality issues later. Cadence's Rich Chang finds that effective UPF low-power verification and debug involves more than o... » read more

Automotive Relationships Shifting With Chiplets


The automotive industry is in the midst of a tremendous and rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. All of this is dependent on the relationships between all o... » read more

Chips Getting More Secure, But Not Quickly Enough


Experts at the Table: Semiconductor Engineering sat down to talk about the impact of heterogeneous integration, more advanced RISC-V designs, and a growing awareness of security threats, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketin... » read more

Blog Review: May 17


Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Machine Vision Plus AI/ML Adds Vast New Opportunities


Traditional technology companies and startups are racing to combine machine vision with AI/ML, enabling it to "see" far more than just pixel data from sensors, and opening up new opportunities across a wide swath of applications. In recent years, startups have been able to raise billions of dollars as new MV ideas come to light in markets ranging from transportation and manufacturing to heal... » read more

Week In Review: Semiconductor Manufacturing, Test


Global semiconductor sales reached $574 billion in 2022, and U.S. semiconductor companies accounted for sales totaling $275 billion, or 48% of the global market, according to the 2023 Factbook released by the Semiconductor Industry Association (SIA). DRAM and NAND prices likely will continue to fall further this quarter because production cuts have not kept pace with weakening demand, accord... » read more

Holistic Power Reduction


The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

Making Tradeoffs With AI/ML/DL


Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

Rethinking Engineering Education In The U.S.


The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Conquer Placement And Clock Tree Challenges In HPC Designs


High-performance computing (HPC) applications require IC designs with maximum performance. However, as process technology advances, achieving high performance has become increasingly challenging. Designers need digital implementation tools and methodologies that can solve the thorny issues in HPC designs, including placement and clock tree challenges. Placement and clock tree synthesis are c... » read more

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