tag: Mentor

The Evolving Role Of AI In Verification
By Ann Mutschler - 26 Mar, 2025 - Comments: 0

Experts At The Table: The pressure on verification engineers to ensure the functional correctness of devices has increased exponentially as chips have gotten more complex and evolved into SoC, 3D-ICs, multi-die chiplets and beyond. Semiconductor Engineering sat down with a panel of experts, which included Josh Rensch, director of application engineering at Arteris; Matt Graham, senior group dir... » read more

Blog Review: Mar. 26
By Jesse Allen - 26 Mar, 2025 - Comments: 0

Siemens' Bianca Ward argues that sustainability must be considered starting from the design phase to reduce the energy consumption of ICs as well as the production processes used to manufacture them. Synopsys' Adrien Tozzoli looks at how physical optics simulation can be improved by using beam synthesis propagation, a method that decomposes the optical field into a collection of beamlets to ... » read more

Chip Industry Week In Review
By The SE Staff - 21 Mar, 2025 - Comments: 0

Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

What Exactly Are Chiplets And Heterogeneous Integration?
By Bryon Moyer - 20 Mar, 2025 - Comments: 1

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they're reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both t... » read more

Chip Failures: Prevention And Responses Over Time
By Ed Sperling - 19 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, hi... » read more

Blog Review: Mar. 19
By Jesse Allen - 19 Mar, 2025 - Comments: 0

Cadence's Neelabh Singh explains the defined port operations of USB4 that are used to bring transmitters burst and receivers of a design under test into compliance mode and to execute tests like bit error tests, error rate tests, clock switch tests, TxFFE equalization tests, and electrical idle tests. Siemens EDA's Stephen V. Chavez examines the use of blind and buried vias in high-density i... » read more

New Data Center Protocols Tackle AI
By Bryon Moyer - 17 Mar, 2025 - Comments: 1

Compute nodes in AI and HPC data centers increasingly need to reach out beyond the chip or package for additional resources to process growing workloads. They may commandeer other nodes in a rack (scale-up) or employ resources in other racks (scale-out). The problem is there currently is no open scale-up protocol. So far this task has been dominated by proprietary protocols, because much of ... » read more

Chip Industry Week In Review
By The SE Staff - 14 Mar, 2025 - Comments: 0

ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist
By Pratyush Kamal - 13 Mar, 2025 - Comments: 0

As we walk around with supercomputers in our pockets and work at desks on even more powerful supercomputers, a lot of processing has moved to the cloud. As a politician described, this can be problematic on a day when there are no clouds in the sky. The world discovered the truth of those words when Crowdstrike struck on July 19, 2024. System designers who spent years balancing power, performan... » read more

3D-IC For The Masses
By Brian Bailey - 13 Mar, 2025 - Comments: 1

The concepts of 3D-IC and chiplets have the whole industry excited. It potentially marks the next stage in the evolution of the IP industry, but so far, technical difficulties and cost have curtailed its usage to just a handful of companies. Even within those, they do not appear to be seeing benefits from heterogeneous integration or reuse. Attempts to make this happen are not new. "A decade... » read more

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