tag: Meta

New Standards Push Co-Packaged Optics
By Karen Heyman - 26 Apr, 2023 - Comments: 0

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

How Chip Engineers Plan To Use AI
By Ed Sperling - 19 Apr, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how AI is being used today and how engineers expect to use it in the future, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; and David Pan, professor in the ... » read more

AI Becoming More Prominent In Chip Design
By Ed Sperling - 27 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

AI: Engineering Tool Or Threat To Jobs?
By Ed Sperling - 02 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about using AI for designing and testing complex chips with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; David Pan, professor in the Department of Electrical and Computer Engineering a... » read more

How To Build Resilience Into Chips
By Ed Sperling and Ann Mutschler - 27 Feb, 2023 - Comments: 0

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

Hunting For Hardware-Related Errors In Data Centers
By Anne Meixner - 07 Feb, 2023 - Comments: 2

The semiconductor industry is urgently pursuing design, monitoring, and testing strategies to help identify and eliminate hardware defects that can cause catastrophic errors. Corrupt execution errors, also known as silent data errors, cannot be fully isolated at test — even with system-level testing — because they occur only under specific conditions. To sort out the environmental condit... » read more

CXL Picks Up Steam In Data Centers
By Marie C. Baca - 26 Jan, 2023 - Comments: 0

CXL is gaining traction inside large data centers as a way of boosting utilization of different compute elements, such as memories and accelerators, while minimizing the need for additional racks of servers. But the standard is being extended and modified so quickly that it is difficult to keep up with all the changes, each of which needs to be verified and validated across a growing swath of h... » read more

Screening For Silent Data Errors
By Anne Meixner - 10 Jan, 2023 - Comments: 0

Engineers are beginning to understand the causes of silent data errors (SDEs) and the data center failures they cause, both of which can be reduced by increasing test coverage and boosting inspection on critical layers. Silent data errors are so named because if engineers don’t look for them, then they don’t know they exist. Unlike other kinds of faulty behaviors, these errors also can c... » read more

Improving Concurrent Chip Design, Manufacturing, And Test Flows
By Ann Mutschler - 28 Nov, 2022 - Comments: 0

Semiconductor design, manufacturing, and test are becoming much more tightly integrated as the chip industry seeks to optimize designs using fewer engineers, setting the stage for greater efficiencies and potentially lower chip costs without just relying on economies of scale. The glue between these various processes is data, and the chip industry is working to weave together various steps t... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 28 Oct, 2022 - Comments: 0

Automotive, mobility Ford Motor Company revealed it lost $827 million in the third quarter because of parts shortages and unexpected supplier costs. Those shortages affected 40,000 to 50,000 vehicles. The company is shutting down its interest in its self-driving car unit Argo.ai, which it shared with Volkswagen since 2019. Ford will instead focus on advanced driver-assist systems (ADAS), which... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy