New Interconnect Metals Need New Dielectrics

By Katherine Derbyshire - 23 Jul, 2024 - Comments: 0

Just as circuit metallization must evolve to manage resistance as features shrink, so must the dielectric half of the interconnect stack. For quite some time, manufacturers have needed a dielectric constant (k) less than 4, which is the value for SiO2, but they have struggled to find materials that combine a low dielectric constant with mechanical and chemical stability. In work presented at... » read more

System Bits: Nov. 28

By Ann Mutschler - 28 Nov, 2017 - Comments: 0

Better absorbing materials  University of Illinois bioengineers have taken a new look at an old tool to help characterize a class of materials called metal organic frameworks (MOFs), used to detect, purify and store gases. The team believes these could help solve some of the world's most challenging energy, environmental and pharmaceutical challenges – and even pull water molecules straigh... » read more

System Bits: Oct. 11

By Ed Sperling - 11 Oct, 2016 - Comments: 0

Carbon Is So 2015 Researchers at MIT have created a supercapacitor that relies on a material other than carbon. This new class of materials, called metal-organic frameworks (MOFs), are a porous and sponge-like, according to MIT, tthereby providing a much larger surface area than carbon. As with most things electrical, more surface area is essential for superconductors. The problem the re... » read more

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tag: metal-organic frameworks

New Interconnect Metals Need New Dielectrics

System Bits: Nov. 28

System Bits: Oct. 11

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