tag: Microchip

Evolution Of The MCU
By Ed Sperling - 26 Oct, 2017 - Comments: 0

Microcontrollers are taking on a variety of new and much more complex computing tasks, evolving from standalone chips to more highly integrated devices that can rival complex microprocessors. Microcontroller units (MCUs) are being designed into everything from assisted and autonomous driving to smart cards. They often are the central processing elements for a slew of connected devices that i... » read more

What’s Next For NOR Flash?
By Mark LaPedus - 16 Feb, 2017 - Comments: 0

The flash memory market is the tale two of cities. Today, NAND and NOR are the two main flash memory types. Over the years, the NAND flash market has exploded. Targeted for data storage, NAND flash has moved into flash cards, solid-state storage drives (SSDs) and other products. The excitement for NAND continues to mount, as the technology is moving from planar to a 3D structure. In fact, 3D... » read more

New Embedded Memories Ahead
By Mark LaPedus - 25 Jan, 2017 - Comments: 0

The embedded memory market is beginning to heat up, fueled by a new wave of microcontrollers (MCUs) and related chips that will likely require new and more capable nonvolatile memory types. The industry is moving on several different fronts in the embedded memory landscape. On one front, traditional solutions are advancing. On another front, several vendors are positioning the next-generatio... » read more

CEO Outlook: Chip Design 2017
By Ed Sperling - 22 Dec, 2016 - Comments: 0

After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

Executive Insight: Charlie Cheng
By Ed Sperling - 03 Nov, 2016 - Comments: 0

[getperson id="11073" comment="Charlie Cheng"], CEO of [getentity id="22135" e_name="Kilopass Technology"], sat down with Semiconductor Engineering to talk about the limitations of DRAM, how to get around them, and who's likely to do that. What follows are excerpts of that discussion. SE: What are the top market segments from a [getkc id="22" kc_name="memory"] standpoint? Cheng: The top o... » read more

Securing The IoT
By Jeff Dorsch - 26 Oct, 2016 - Comments: 1

Last week’s massive distributed denial-of-service attack, directed at Dyn DNS—a small New Hampshire-based company that operates part of the Internet’s Domain Name System—brought many popular websites to a crawl. Among those affected were such giants as Airbnb, Reddit, Twitter, Amazon and Netflix. The Internet outages spread from the East Coast of the United States to the rest of the ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

The Mightier Microcontroller
By Ed Sperling - 26 May, 2016 - Comments: 1

Microcontrollers are becoming more complex, more powerful, and significantly more useful, but those improvements come with strings attached. While it's relatively straightforward to develop multi-core microcontroller (MCU) hardware with advanced power management features, it's much more difficult to write software for these chips because memory is limited. CPUs can use on-chip memory such as... » read more

Ray Zinn Reflects On 37 Years As CEO Of Micrel
By Brian Bailey - 26 May, 2016 - Comments: 0

Believed to be the longest serving CEO of any company to have existed in Silicon Valley, Ray Zinn does more in retirement than many people would accomplish as full time employees. While his name may not be at the top of most influential people in the valley, the industry may not be the same today had it not been for his contributions. Semiconductor Engineering spoke with him about his past, the... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jan, 2016 - Comments: 0

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8-gigabit core dies on top. These are then vertically interconnected by TSV holes and microbumps. A single 8Gb HBM2 die contains over 5,000 T... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy