tag: Micron Technology

Photomask Changes And Challenges At Mature And Advanced Nodes
By Gregory Haley - 16 Jun, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the current state and future direction of mask-making, with Harry Levinson, principal lithographer at HJL Lithography; Aki Fujimura, CEO of D2S; Ezequiel Russell, senior director of mask technology at Micron; and Christopher Progler, executive vice president and CTO at Photronics. What follows are excerpts of that conversation.... » read more

Chip Industry Week in Review
By The SE Staff - 13 Jun, 2025 - Comments: 0

The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Automotive Outlook 2025: Ecosystem Pivots Around SDV
By Ann Mutschler - 06 Feb, 2025 - Comments: 0

The automotive industry is deep in the throes of a massive shift to software-defined vehicle architectures, a multi-year effort that will change the way automotive chips are designed, where they are used, and how they are sourced. Creating a new vehicle architecture is no small feat. OEMs need to figure out who to partner with and which aspects of their current architecture to include. This ... » read more

Chip Industry Week In Review
By The SE Staff - 10 Jan, 2025 - Comments: 0

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Chip Industry Week in Review
By The SE Staff - 03 Jan, 2025 - Comments: 0

Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)
By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors" was published by researchers at Micron and Intel. Abstract "High-Performance Computing (HPC) and Artificial Intelligence (AI) workloads typically demand substantial memory bandwidth and, to a degree, memory capacity. CXL memory expansion modules, also known... » read more

Chip Industry Week In Review
By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Luminary Panel Sees Multi-Beam Mask Writers And Curvilinear Masks Key To 193i And EUV
By Jan Willis - 24 Oct, 2024 - Comments: 0

Attendance was up and the mood was optimistic at this year’s SPIE Photomask and EUV conference held September 29 through October 3, 2024. The optimism was apparent as well for multi-beam mask writers and curvilinear masks during the eBeam Initiative’s 15th annual reception and meeting held on October 1. In the eBeam Initiative’s annual Luminaries survey, 93% of those surveyed said that pu... » read more

Blog Review: Aug. 21
By Jesse Allen - 21 Aug, 2024 - Comments: 0

Cadence's Reela Samuel explores the critical role of PCIe 6.0 equalization in maintaining signal integrity and solutions to mitigate verification challenges, such as creating checkers to verify all symbols of TS0, ensuring the correct functioning of scrambling, and monitoring phase and LTSSM state transitions. Siemens' John McMillan introduces an advanced packaging flow for Intel's Embedded ... » read more

CD Spec For Curvilinear Masks
By D2S - 23 Jul, 2024 - Comments: 0

Within the photomask industry, there's a major transformation from conventional Manhattan masks to more advanced curvilinear masks. Researchers from D2S and Micron Technology propose an equivalent CD spec for the curvy masks and use this spec to show that curvy masks have smaller mask variations than Manhattan masks. Find the technical paper here. Published June 2024. Linyong (Leo) Pang, ... » read more

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