tag: Micron

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Feb, 2021 - Comments: 0

Chipmakers The U.S. Semiconductor Industry Association (SIA) and several chip executives have sent a joint letter to President Biden, urging the administration to include substantial funding for semiconductor manufacturing and research in the U.S. As reported, the share of global semiconductor manufacturing capacity in the U.S. has decreased from 37% in 1990 to 12% today. “Semiconductors pow... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Feb, 2021 - Comments: 0

Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

DRAM’s Persistent Threat To Chip Security
By Bryon Moyer - 10 Feb, 2021 - Comments: 0

A well-known DRAM vulnerability called "rowhammer," which allows an assailant to disrupt or take control of a system, continues to haunt the chip industry. Solutions have been tried, and new ones are being proposed, but the potential for a major attack persists. First discovered some five years ago, most of the efforts to eliminate the "rowhammer" threat have done little more than mitigate t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

More Data, More Memory-Scaling Problems
By Bryon Moyer - 14 Jan, 2021 - Comments: 0

Memories of all types are facing pressures as demands grow for greater capacity, lower cost, faster speeds, and lower power to handle the onslaught of new data being generated daily. Whether it's well-established memory types or novel approaches, continued work is required to keep scaling moving forward as our need for memory grows at an accelerating pace. “Data is the new economy of this ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Dec, 2020 - Comments: 0

Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

What’s Next In AI, Chips And Masks
By Mark LaPedus - 19 Nov, 2020 - Comments: 0

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to talk about AI and Moore’s Law, lithography, and photomask technologies. What follows are excerpts of that conversation. SE: In the eBeam Initiative’s recent Luminary Survey, the participants had some interesting observations about the outlook for the photomask market. What were those observations? Fujimur... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Nov, 2020 - Comments: 0

Chipmakers and OEMs Apple has introduced a new MacBook Air, 13-inch MacBook Pro, and Mac mini powered by the M1, the first in a family of chips designed by Apple specifically for the Mac. Based on a 5nm process from TSMC, the M1 is packed with 16 billion transistors, the most Apple has ever put into a chip. It features a CPU core, graphics, AI and other functions all in the same chip. In total... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 09 Oct, 2020 - Comments: 0

Security A new certification program for hardware verification engineers from Edaptive Computing Inc (ECI) and OneSpin Solutions promises to help companies meet IC integrity standards for SoC designs for 5G, IoT, AI, automotive, industrial, defense, and avionics. These designs are often complex, with a variety of elements, such as programmable logic and different cores. The OneSpin Formal Veri... » read more

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