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Blog Review: Dec. 21

Log4J vulnerability; logging in Python for UVM; formal cloud; auto-vectorization.

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Cadence’s Paul McLellan points to Log4J, a logging utility with a new major vulnerability that could affect hundreds of millions of devices, what’s being done to address it, and why the underlying problems may be around for decades.

Siemens EDA’s Ray Salemi continues explaining how to use Python for verification by checking out the Python logging module for pyuvm and how it compares to UVM reporting classes.

Synopsys’ Pratik Mahajan and AWS’ Ahmed Elzeftawi discuss how they collaborated to migrate formal verification to the cloud resulting in both improved turnaround time and convergence.

Arm’s Giacomo Gabrielli and Peng Sun introduce a hardware-software codesign technique called Speculative Vectorization with Selective Replay (SRV) to extend the coverage of auto-vectorization to loops with unknown memory dependencies.

Ansys’ Tim Palucka checks out a startup aimed at using balloons to lift small rockets into the atmosphere, where the rockets could then be launched above the atmosphere and carry their cargo to a predetermined destination in space.

In a video, VLSI Research’s Dan Hutcheson chats with Jim Handy of Objective Analysis about the status of the memory market, what unfolded differently than expected in 2021, and market predictions for the upcoming year.

In a blog for SEMI, KX’s Bill Pierson finds out how experts from EMD Group and Micron collaborated to implement a shared data ecosystem that covers materials to finished goods to get the most out of AI and smart manufacturing methods.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Executive Editor Mark LaPedus zeroes in on the chip and tools outlook.

Amkor’s Ruben Fuentes shows how to ensure an IC package will meet manufacturability and performance requirements.

Coventor’s Sandy Wen explores the impact of process variation on DRAM wordline resistance.

Brewer Science’s Jessica Albright explains how to prevent unexpected downtime with condition monitoring and analysis.

VLSI Research’s John West finds that more and increasingly complex dry etch steps have led to a boom for cooling systems.

Calibra’s Jan Willis explains why pellicles, inspection, and turnaround time are having an impact on EUV photomask cost.

Fraunhofer IIS EAS’ Christian Skubich and Nico Peter examine the challenges and benefits of applying Agile methods to hardware development.

Infineon’s Edmund Neo and Rolf Weber examine new features that can differentiate AR glasses.



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