tag: Micron

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Aug, 2018 - Comments: 0

Chipmakers GlobalFoundries said that it is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. To be sure, it was a tough decision by GF to put 7nm on hold. But generally, analysts believe that GF made the right decision. “There’s only a handful of semiconductor companies that will require high-volume 7nm technology right when... » read more

3D NAND Flash Wars Begin
By Mark LaPedus - 20 Aug, 2018 - Comments: 0

3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Next-Gen Memory Ramping Up
By Mark LaPedus - 16 Aug, 2018 - Comments: 6

The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

Big Shifts In Tech Conferences
By Ed Sperling - 16 Aug, 2018 - Comments: 0

By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Jul, 2018 - Comments: 0

Chipmakers TSMC has reduced its outlook for 2018 revenue and capital spending, according to Bloomberg. The company blamed the outlook on sluggish “mobile and digital currency mining demand,” according to the report. Samsung has developed the industry’s first 10nm-class 8-gigabit LPDDR5 DRAM. The 8Gb LPDDR5 boasts a data rate of up to 6,400 megabits-per-second (Mb/s), which is 1.5 tim... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Jul, 2018 - Comments: 0

Chipmakers Last year, Micron filed suit against UMC, alleging that UMC stole memory technology from the company and transferred it to Jinhua Integrated Circuit Co., a DRAM maker in China. In response, UMC filed patent infringement lawsuits against Micron in the mainland China courts in January of 2018 This week, Micron appears to have suffered a legal setback in its suit against Taiwan�... » read more

China IP Battle Takes New Turn
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

Micron Technology appears to have suffered a legal setback in its suit against Taiwan’s United Microelectronics Corp. (UMC) in China. On Tuesday, UMC announced that the Fuzhou Intermediate People's Court of the People's Republic of China (PRC) issued a preliminary injunction against Micron Semiconductor (Xi'an) and Micron Semiconductor (Shanghai), enjoining Micron from offering to sell, an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jun, 2018 - Comments: 0

Chipmakers Intel has announced the resignation of Brian Krzanich as chief executive and a member of the board. The board has named Chief Financial Officer Robert Swan as interim chief executive, effective immediately. Intel was recently informed that Krzanich had a “past consensual relationship” with an Intel employee. This is a violation of Intel’s non-fraternization policy, which ap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jun, 2018 - Comments: 0

Fab tools Applied Materials has launched a suite of products that will enable cobalt metallization schemes for contacts and interconnects in chips at advanced nodes. The products from Applied enable a complete cobalt fill process. The tools include CMP, CVD, PVD and RTP systems. At advanced nodes, cobalt promises to reduce unwanted resistance in the critical parts of a chip. Cobalt is bein... » read more

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