tag: Micron

China IP Battle Takes New Turn
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

Micron Technology appears to have suffered a legal setback in its suit against Taiwan’s United Microelectronics Corp. (UMC) in China. On Tuesday, UMC announced that the Fuzhou Intermediate People's Court of the People's Republic of China (PRC) issued a preliminary injunction against Micron Semiconductor (Xi'an) and Micron Semiconductor (Shanghai), enjoining Micron from offering to sell, an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jun, 2018 - Comments: 0

Chipmakers Intel has announced the resignation of Brian Krzanich as chief executive and a member of the board. The board has named Chief Financial Officer Robert Swan as interim chief executive, effective immediately. Intel was recently informed that Krzanich had a “past consensual relationship” with an Intel employee. This is a violation of Intel’s non-fraternization policy, which ap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jun, 2018 - Comments: 0

Fab tools Applied Materials has launched a suite of products that will enable cobalt metallization schemes for contacts and interconnects in chips at advanced nodes. The products from Applied enable a complete cobalt fill process. The tools include CMP, CVD, PVD and RTP systems. At advanced nodes, cobalt promises to reduce unwanted resistance in the critical parts of a chip. Cobalt is bein... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 May, 2018 - Comments: 0

Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pri... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

What Happened To Nanoimprint Litho?
By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

DSA Re-Enters Litho Picture
By Mark LaPedus - 15 Mar, 2018 - Comments: 1

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

RISC-V Gains Its Footing
By Ann Mutschler - 26 Feb, 2018 - Comments: 3

The RISC-V instruction-set architecture, which started as a UC Berkeley project to improve energy efficiency, is gaining steam across the industry. The RISC-V Foundation's member roster gives an indication who is behind this effort. Members include Google, Nvidia, Qualcomm, Rambus, Samsung, NXP, Micron, IBM, GlobalFoundries, UltraSoC, Siemens, among many others. One of the key markets for... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

Going Beyond GPUs With GDDR6
By Rambus - 31 Jan, 2018 - Comments: 0

Supported by Micron Technology, SK Hynix and Samsung, GDDR6 SGRAM will feature a maximum data transfer rate of 16 Gbps, along with an operating voltage of 1.35V. Although initially targeted at game consoles and PC graphics, the latest iteration of GDDR is expected to be deployed across multiple verticals, with Micron specifically highlighting the data center and automotive sector. Similarly,... » read more

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