The Week In Review: Manufacturing

By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

3D NAND Market Heats Up

By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

IoT Will Force New Memory Paradigm

By Ernest Worthman - 05 Feb, 2015 - Comments: 1

There are two things in life that have always been true: One is that you can never be too rich, and second—at least since the dawn of the technological age—you can never have too much memory. But the memory truism is changing with the onset of the [getkc id="76" comment="Internet of Things"]. The next generation of memory for the IoT must meet a different set of metrics – smaller, smar... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 30 Jan, 2015 - Comments: 0

This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

Is The Stacked Die Ecosystem Stagnating?

By Ann Mutschler - 18 Dec, 2014 - Comments: 2

It is now widely agreed that not much has been happening in terms of adoption for 2.5D interposer and 3D ICs. “It seems like everyone is still at the starting line waiting for the race to begin," said Javier DeLaCruz, senior director of engineering of [getentity id="22242" e_name="eSilicon"]. "Interposer assembly and IP availability for effectively using the [getkc id="82" comment="2.5D IC... » read more

Solid Years: Cautious Optimism Drives Equipment Spending Into 2015

By Christian Dieseldorff - 11 Dec, 2014 - Comments: 0

Worldwide semiconductor capital expenditure growth for this year is expected to be 11% and will increase another 8% in 2015. Throughout 2014, SEMI has tracked 177 facilities worldwide investing about US$34 billion on semiconductor equipment. In 2015, 190 facilities are being tracked with fab equipment spending worth over $40 billion. The double-digit growth in fab equipment spending for this ye... » read more

Hybrid Memory Cube – Ready For Prime Time

By Manohar Ayyagiri - 20 Nov, 2014 - Comments: 0

With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

ATE Market Gets More Crowded

By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Over the years, the automatic test equipment (ATE) industry has undergone a dramatic shakeout. In fact, the ATE industry has shrunk from about a dozen major vendors several years ago to just three sizable companies today. There is also a smattering of smaller ATE players in the market. In other words, the big ATE vendors became bigger and the mid-sized players were gobbled up. The consol... » read more

Multi-Die Packaging Gains Steam

By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

Different Approaches Emerge For Stacking Die

By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

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tag: Micron

The Week In Review: Manufacturing

3D NAND Market Heats Up

IoT Will Force New Memory Paradigm

The Week In Review: Manufacturing

Is The Stacked Die Ecosystem Stagnating?

Solid Years: Cautious Optimism Drives Equipment Spending Into 2015

Hybrid Memory Cube – Ready For Prime Time

ATE Market Gets More Crowded

Multi-Die Packaging Gains Steam

Different Approaches Emerge For Stacking Die