tag: Micron

ATE Market Gets More Crowded
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Over the years, the automatic test equipment (ATE) industry has undergone a dramatic shakeout. In fact, the ATE industry has shrunk from about a dozen major vendors several years ago to just three sizable companies today. There is also a smattering of smaller ATE players in the market. In other words, the big ATE vendors became bigger and the mid-sized players were gobbled up. The consol... » read more

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

Different Approaches Emerge For Stacking Die
By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

What’s Next For Memory?
By Mark LaPedus - 14 Aug, 2014 - Comments: 4

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to integrate new memory schemes that provide more bandwidth at lower power. But there are some challenges in the arena that are prompting memory makers to rethink their mobile DRAM roadmaps. The conventional wisdom was that memory makers would ship mobile DRAMs based on the new LPDDR4 interface stand... » read more

Manufacturing Bits: July 1
By Mark LaPedus - 01 Jul, 2014 - Comments: 0

Nanotubes in 4D The California Institute of Technology (Caltech) has continued to advance its efforts in four-dimensional electron microscopy. In 4D microscopy, electrons bombard a sample. Each electron scatters off the sample. This produces an image at just a femtosecond in duration. Then, millions of the images are stitched together, which, in turn, produces a digital movie in 4D. [cap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 May, 2014 - Comments: 0

IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Apr, 2014 - Comments: 0

Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

Improving Yield Of 2.5D Designs
By Ann Mutschler - 18 Apr, 2014 - Comments: 0

While progress is being made on the packaging side of 2.5D design, more needs to be resolved when it comes to improving yields. Proponents of 2.5D present compelling benefits. Arif Rahman, a product architect at Altera, noted that the industry trend of silicon convergence is leading to multiple technologies being integrated into single-chip solutions. “2.5D/3D integration has multiple adva... » read more

Time To Revisit 2.5D And 3D
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Mar, 2014 - Comments: 0

RBC Capital Markets has raised its iPhone unit forecast for 2014 to 159.1 million from 156.7 million. The iPhone estimates reflect better-than-expected growth in the September quarter, according to RBC. So which chipmakers will benefit? In order, the companies with the most exposure into Apple are Cirrus Logic, Dialog Semiconductor, Triquint, Skyworks, Audience, Avago, Broadcom, Qualcomm, SanDi... » read more

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