tag: Micron

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 14 Feb, 2014 - Comments: 0

Prosecutors have charged the CEO of chipmaker Entropic Communications with assaulting a model who appeared on the reality television show "Beverly Hills Nannies," according to the L.A. Times. Molecular Imprints Inc. (MII) has signed an agreement to sell its semiconductor imprint lithography equipment business to Canon. The agreement also allows for the creation of a new company that will ke... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 24 Jan, 2014 - Comments: 0

Look for a nasty political campaign in Idaho, according to Bloomberg. Business leaders from Micron Technology and others in Idaho are endorsing the incumbent Republican candidate over a Tea Party challenger. The challenger, Bryan Smith, is a conservative Republican running for Idaho’s second congressional district. He is running against 16-year incumbent Mike Simpson. Simpson is supposedly pr... » read more

The Bumpy Road To 3D NAND
By Mark LaPedus - 23 Jan, 2014 - Comments: 1

The NAND flash memory market is dynamic, but it’s also sometimes predictable. Suppliers tend to roll out identical NAND flash chips and then scale them to smaller geometries. And NAND chip prices rise and fall, depending on the supply/demand equation at a given point. Going forward, though, the NAND market is expected to become less predictable, if not chaotic, amid a new and major technol... » read more

The Week In Review: Manufacturing And Design
By Mark LaPedus - 10 Jan, 2014 - Comments: 1

Crucial.com reveals a surprising way to gain more time for improving one's personal health: fix a slow computer. A nationwide survey revealed that U.S. adults think they waste an average of 16 minutes per day waiting for their computer to load or boot up. Equating to two hours each week and four days per year lost to the wiles of a slow computer, it's no surprise that 66% of Americans say that ... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 13 Dec, 2013 - Comments: 0

Tensions between the U.S. and China are growing. In a research report, Gus Richard, an analyst at Piper Jaffray, said: “The technology sector is being impacted by U.S./Chinese tensions over cybersecurity. The combination of Huawei being blocked from doing business in the United States and the Snowden affair are impacting U.S. tech companies' prospects in China. China’s state-run media ident... » read more

2014 CapEx: Memory Is Leading The Way
By Adrienne Downey - 12 Dec, 2013 - Comments: 0

The semiconductor industry is expensive. Billions of dollars are spent every year to keep the fabs running, build new fabs, and push the process technology to greater and greater heights. Billions more will be spent to make 450mm production a reality. In January 2013, Semico predicted that, based on initial indications from some companies, total CapEx would be flat this year. Based on current d... » read more

Challenges Mount In Inspection And Metrology
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Chipmakers are moving full speed ahead toward smaller process nodes, thereby driving up the costs and complexities in chip manufacturing. The migrations also are putting enormous stress on nearly all points of the fab flow, including a critical but unsung part of the business—process control. Process control involves 20 or so different segments in the inspection and metrology arena. Genera... » read more

Semiconductor New Equipment Market $32.0 Billion For 2013
By Lara Chamness - 12 Dec, 2013 - Comments: 0

Orders for new equipment slowly improved early on in 2013, with bookings reaching a peak by the second quarter before receding in the third quarter. Over this time, equipment billings, while increasing, were trending below 2012 levels. In October, book-to-bill data from both SEMI and the SEAJ show bookings are increasing once again, and this indicates a stronger fourth quarter for the semico... » read more

Momentum Builds For Monolithic 3D ICs
By Mark LaPedus - 14 Nov, 2013 - Comments: 1

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

What’s After 3D NAND?
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

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