tag: Microsoft

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Dec, 2019 - Comments: 0

Chipmakers and OEMs TrendForce has released its projected foundry rankings for the fourth quarter of 2019. TSMC remains in first place, followed by Samsung, GlobalFoundries and UMC, according to the firm. “TrendForce projects the foundry industry’s 4Q19 revenue performance to exceed previous expectations,” according to the firm. “Nonetheless, the ongoing U.S-China trade war and uncerta... » read more

Combining Digital Twins And IoT In The Cloud
By Sameer Kher - 12 Dec, 2019 - Comments: 0

Engineers are tasked with the continuous improvement of the products, services and systems they design. The trouble is, once a product is out in the field, it’s hard to know how that design is performing — or being used. By coupling digital twin and internet of things (IoT) technology, engineers can get a better idea of a product’s real-world performance. As a reminder, digital twins a... » read more

October ’19 Startup Funding: Mega Harvest
By Jeff Dorsch - 11 Nov, 2019 - Comments: 0

Seventeen startups took in mega-rounds of $100 million or more during October, with a cumulative total of just over $3.2 billion. Cybersecurity startups continued to be popular with private investors during the month of October, with 15 financing rounds. Twenty automotive and mobility technology firms picked up new investments. Analytics firms, artificial intelligence/machine learning techno... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Nov, 2019 - Comments: 0

Cadence unveiled a static timing/signal integrity analysis and power integrity analysis tool, Tempus Power Integrity Solution, that integrates the Tempus Timing Signoff and Voltus IC Power Integrity signoff engines. Early use cases demonstrated it correctly identified IR drop errors, avoiding silicon failure prior to tapeout and improving the maximum frequency in silicon by up to 10%. Arasan... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Oct, 2019 - Comments: 0

Synopsys completed its acquisition of QTronic GmbH, a provider of simulation, test tools, and services for automotive software and systems development. Terms of the deal were not disclosed. Synopsys launched the PrimeECO design closure solution, a signoff-driven solution that the company says achieves signoff closure with zero iterations. The tool includes a machine-learning-driven Hybrid Ti... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Survival Of The Cheapest?
By Brian Bailey - 26 Sep, 2019 - Comments: 0

We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

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