tag: Microsoft

The Darker Side Of Consolidation
By Ed Sperling - 02 Jul, 2018 - Comments: 1

Another wave of consolidation is underway in the semiconductor industry, setting the stage for some high-stakes competitive battles over market turf and sowing confusion across the supply chain about continued support throughout a product's projected lifetime. The consolidation comes as chipmakers already are grappling with rising complexity, the loss of a roadmap for future designs as Moore... » read more

Week in Review: IoT, Auto, Security
By Jeff Dorsch - 29 Jun, 2018 - Comments: 0

Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

What’s Next In R&D?
By Mark LaPedus - 21 Jun, 2018 - Comments: 1

Luc Van den hove, president and chief executive of Imec, sat down with Semiconductor Engineering to discuss R&D challenges and what’s next in the arena. The Belgium R&D organization is working on AI, DNA storage, EUV, semiconductors and other technologies. What follows are excerpts of that conversation. SE: Moore’s Law is slowing down. And it is becoming more expensive to move fr... » read more

The Week in Review: IoT
By Jeff Dorsch - 15 Jun, 2018 - Comments: 0

Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

New Transistor Types Vs. Packaging
By Ed Sperling - 11 Jun, 2018 - Comments: 0

Plans are being formulated for the rollout of multiple types of gate-all-around FETs and literally dozens of advanced packaging options. The question now is which ones will achieve critical mass, because there aren't enough chips in the world to support all of them profitably. FinFETs, which were first introduced by Intel at 22nm, are running out of steam. While they will survive 10/7nm, and... » read more

The Week in Review: IoT
By Jeff Dorsch - 08 Jun, 2018 - Comments: 0

Finance CyberInt raised $18 million in new funding led by Viola Growth and including existing investors. The company provides cybersecurity detection and response services. CyberInt has offices in Israel, the U.S., the United Kingdom, Singapore, and Panama. San Diego-based Kneron, which provides artificial intelligence technology for edge devices, received $18 million in Series A1 funding l... » read more

Why IIoT Security Is So Difficult
By Kevin Fogarty - 29 May, 2018 - Comments: 0

Despite the high risk of a market filled with billions of at least partially unprotected devices, it is likely to take five years or more to reach a "meaningful" level of security in the Industrial IoT. The market, which potentially includes every connected device with an integrated circuit, is fragmented into vertical industries, specialty chips, and filled with competing OEMs, carriers, in... » read more

The Week in Review: IoT
By Jeff Dorsch - 11 May, 2018 - Comments: 0

Conferences Internet of Things World 2018 takes place next week at the Santa Clara Convention Center in Silicon Valley. Executives of GE Digital, The Chamberlain Group, and UPS will be among those giving keynote addresses during the four-day conference. Monday will see pre-conference workshops, followed by three days of keynotes, presentations, and an expo floor taking in 100,000 square feet o... » read more

Higher Performance, Lower Power Everywhere
By Ed Sperling - 10 May, 2018 - Comments: 0

The future of technology is all about information—not just data—at our fingertips, anywhere and at any time. But making all of this work properly will require massive improvements in both performance and power efficiency. There are several distinct pieces to this picture. One is architectural, which is possibly the simplest to understand, the most technologically challenging to realize, ... » read more

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