Chip Industry Week In Review

By The SE Staff - 14 Jun, 2024 - Comments: 0

Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Chip Industry Week In Review

By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry Week In Review

By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Chip Industry Week In Review

By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Chip Industry Week In Review

By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Chip Industry’s Technical Paper Roundup: November 6

By Liz Allan - 06 Nov, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=162 /] More Reading Technical Paper Library home » read more

A New Architecture And Verification Approach For Hardware Security Modules

By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “The K2 Architecture for Trustworthy Hardware Security Modules” was published by researchers at MIT Computer Science and Artificial Intelligence Laboratory (CSAIL) and New York University. Abstract: "K2 is a new architecture and verification approach for hardware security modules (HSMs). The K2 architecture's rigid separation between I/O, storage, and computation ... » read more

Optimizing Hardware Capacity, Utilizing Automatic Differentiation to Efficiently Compute Derivatives in Parallel Programming Models

By Technical Paper Link - 30 Nov, 2022 - Comments: 0

A technical paper titled "Scalable Automatic Differentiation of Multiple Parallel Paradigms through Compiler Augmentation" was published by researchers at MIT (CSAIL), Argonne National Lab, and TU Munich. The paper was a Best Paper Finalist and a Best Student Paper winner at SuperComputing 2022. Find the technical paper here. Published November 2022. The work "demonstrates how Enzyme opti... » read more

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tag: MIT CSAIL

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry’s Technical Paper Roundup: November 6

A New Architecture And Verification Approach For Hardware Security Modules

Optimizing Hardware Capacity, Utilizing Automatic Differentiation to Efficiently Compute Derivatives in Parallel Programming Models

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