Power/Performance Bits: July 2


Using low-power Wi-Fi to track moving humans Based on a concept similar to radar and sonar imaging, researchers at MIT’s Computer Science and Artificial Intelligence Laboratory have created a system capable of seeing people through walls. Previous efforts to develop such a system have involved the use of expensive and bulky radar technology that uses a part of the electromagnetic spectrum on... » read more

Simple Economics


By Jon McDonald I was watching one of the MIT OpenCourseWare videos the other day. It was one of the lectures on Computer Science. I believe it was Prof. Robert Gallager who made a statement that really got me thinking: “Increasingly, system computational complexity has little impact on cost because of chip technology.” From a hardware perspective I initially had a bit of trouble with t... » read more

How To Make A Brain-On-A-Chip


By Mark LaPedus In October, Draper Laboratory and the University of South Florida (USF) disclosed an ambitious plan to develop a brain-on-a-chip. The idea is to devise a “micro-environment’’ that mimics the human brain. Researchers hope to study neurodegenerative conditions such as Alzheimer’s disease, strokes and concussions. The eventual goal is to study the effects of drugs and v... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA


The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

DSA: High Stakes Game Of Alphabet Soup


By Mark LaPedus Directed self-assembly (DSA) is making progress for potential use in semiconductor production, but the industry must make some major advances in a sometimes forgotten and unsung segment—materials. DSA is a complementary patterning technology that makes use of block copolymer materials to enable fine pitches in chip designs. But today’s block copolymers based on poly (MMA... » read more

3D Integration: Extending Moore’s Law Into The Next Decade


By Cheryl Ajluni At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, according to Philippe Magarshack, the general manager of Central CAD & Design Solutions at STMicroelectronics, is 3D stacking for complex System-on-Chips (SoCs). The concept of 3... » read more

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