tag: MIT

New Low-Temp Growth & Fabrication Technology Allowing Integration of 2D Materials Directly Onto A Silicon Circuit (MIT)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform" was published by researchers at MIT, Oak Ridge National Laboratory, and Ericsson Research. According to this MIT news article: "Growing 2D materials directly onto a silicon CMOS wafer has posed a major challenge because the process u... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Apr, 2023 - Comments: 0

The U.S. Commerce Department  launched Chips.gov, a website that covers all aspects of the CHIPS Act, including funding opportunities and job openings. In similar vein, Intel CEO Pat Gelsinger focused on the future of semiconductor manufacturing in America in a talk at MIT. Intel has committed to expanding semiconductor manufacturing in the U.S., including spending an initial $20 billion on ne... » read more

Research Bits: April 10
By Jesse Allen - 10 Apr, 2023 - Comments: 0

Meminductor identified Researchers at Texas A&M University identified the meminductor circuit unit. Similar to the memristor and the memcapacitor, a meminductor has a memory-like nature where its properties are dependent on previous values. The resistor, capacitor, and inductor comprise the three classical circuit elements. The memristor and the memcapacitor, while earlier theorized, ha... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Apr, 2023 - Comments: 0

MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Mechanical Challenges Rise With Heterogeneous Integration
By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Research Bits: March 14
By Jesse Allen - 14 Mar, 2023 - Comments: 0

Shift register-in-memory architecture Researchers at the Singapore University of Technology and Design propose a new reconfigurable shift register-in-memory architecture for devices that can work both as a reconfigurable memory component and as a programmable shift register. The device is based on phase-change alloys, which can switch reversibly between the glassy amorphous state and the or... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 10 Mar, 2023 - Comments: 0

Rambus will begin selling Arm's CryptoCell embedded security platform and CryptoIsland root-of-trust cores, setting the stage for a much broader push by Rambus into security for a wide range of connected devices, and ultimately into security as a service. Under the terms of the deal, Rambus' customers will be able to license Arm IP directly from Rambus. For Arm's existing customers, there will ... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Week In Review: Semiconductor Manufacturing & Test
By Gregory Haley - 17 Feb, 2023 - Comments: 0

The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has halted work on its second memory plant near Wuhan, and ChangXin Memory Technologies (CMTX) says its second production facility, slated to open in 2023, will be delayed until 2024 or 2025. In an effo... » read more

Week In Review: Design, Low Power
By Linda Christensen - 17 Feb, 2023 - Comments: 0

It’s earnings season. Arm, Cadence, Synopsys, Siemens (consolidated), Rambus, and Renesas reported quarterly results over the past couple weeks. All posted year-over-year revenue growth, despite an overall challenging macroeconomic climate. A roundup of all the chip industry earnings reports from the past several weeks can be found here. The edge computing market is projected to jump to al... » read more

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