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Making Chips At 3nm And Beyond


Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Manufacturing Bits: Feb. 18


Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more