AI Performance And Real-Time Control In Robotics And Autonomous Applications

By Shingo Kojima - 07 Mar, 2024 - Comments: 0

Recent vision AI models have to deal with dynamic and complex environments, resulting in the need for more power efficiency and speed in real-time applications. To meet the market needs, Renesas released the next-generation Dynamically Reconfigurable Processor for AI (DRP-AI) accelerator. The DRP-AI accelerator delivers high-power efficiency of 10 TOPS/W, up to 10 times higher than the conve... » read more

Cold Plate Technology Comparison

By Ansys - 07 Jun, 2023 - Comments: 0

New types of energy, such as wind and solar power, are being utilized more prevalently and hybrid cars/buses are being identified as a means of reducing carbon dioxide emissions resulting from the use of fossil fuels. Electronic systems like frequency converters for wind power and train utilization are required to provide ever higher levels of energy savings. As such, IGBT (insulated-gate bipol... » read more

Isolation Device Solution For Intelligent Power Module (IPM) Drive To Realize High-Accuracy Industrial Equipment In High Noise Environment

By Renesas - 22 Jun, 2022 - Comments: 0

As efforts to protect the environment have advanced, the use of inverters in industrial applications and green energy systems have continued to grow rapidly as a way to achieve low-power motor control and reduce power conversion loss. In recent years, this demand has been increasing more and more in relation to Sustainable Development Goals (SDGs). Further improvement in accuracy and downsizing... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: motor control

AI Performance And Real-Time Control In Robotics And Autonomous Applications

Cold Plate Technology Comparison

Isolation Device Solution For Intelligent Power Module (IPM) Drive To Realize High-Accuracy Industrial Equipment In High Noise Environment