tag: multi-chip package

Chip Package Co-design and Physical Verification for Heterogeneous Integration
By Technical Paper Link - 12 Nov, 2021 - Comments: 0

Abstract: "Physical verification of components in 2.5D and 3D integrated chips is challenging because existing tool flows have evolved from monolithic silicon design. These components are typically designed on separate technology nodes nearly independent of each other and integrated along the design cycle. We developed an integration and verification methodology with a physical design driven... » read more

LDFO SiP For Wearables & IoT With Heterogeneous Integration
By Amkor - 02 Dec, 2020 - Comments: 0

Authors A. Martins*, M. Pinheiro*, A. F. Ferreira*, R. Almeida*, F. Matos*, J. Oliveira*, Eoin O´Toole*, H. M. Santos†, M. C. Monteiro‡, H. Gamboa‡, R. P. Silva* ‡Fraunhofer Portugal AICOS, Porto, Portugal †INESC TEC *AMKOR Technology Portugal, S.A. ABSTRACT The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the require... » read more

What’s Ahead For System-Level Design
By Ed Sperling - 19 Dec, 2012 - Comments: 0

By Ann Steffora Mutschler Architecting an SoC today is incredibly difficult. When you add in the number of available transistors, the manufacturing effects of smaller nodes, IP and software that must be integrated, among other things, the challenges just keep mounting. Depending on what market segment the SoC will be designed into has a huge impact, as well. “It is impossible to ove... » read more

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