Manufacturing Bits: March 2

By Mark LaPedus - 02 Mar, 2021 - Comments: 0

Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Manufacturing Bits: March 24

By Mark LaPedus - 24 Mar, 2020 - Comments: 0

Autonomous microscopes FLEET, also known as the ARC Centre of Excellence in Future Low-Energy Electronics Technologies, has developed an autonomous scanning probe microscopy (SPM) technology. SPM is an instrument that makes use of an atomically sharp probe. The probe is placed in close proximity above the surface of a sample. With the probe, the SPM forms images of the surface of the sample... » read more

Manufacturing Bits: Nov. 5

By Mark LaPedus - 05 Nov, 2019 - Comments: 0

Nanoliter measurements The National Institute of Standards and Technology (NIST) has developed an optofluidic measurement system that can measure the flow of liquids at the nanoliter scale. Targeted for the field of microfluidics, the system can measure the flow of liquids as small as 10 billionths of a liter per minute. A nanoliter (nL) is one billionth of a liter. A liter is 33.814 ounces... » read more

Quantum Effects At 7/5nm And Beyond

By Ed Sperling - 23 May, 2018 - Comments: 5

Quantum effects are becoming more pronounced at the most advanced nodes, causing unusual and sometimes unexpected changes in how electronic devices and signals behave. Quantum effects typically occur well behind the curtain for most of the chip industry, baked into a set of design rules developed from foundry data that most companies never see. This explains why foundries and manufacturing e... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: nanoScience Instruments

Manufacturing Bits: March 2

Manufacturing Bits: March 24

Manufacturing Bits: Nov. 5

Quantum Effects At 7/5nm And Beyond