Manufacturing Bits: Sept. 4

By Mark LaPedus - 04 Sep, 2018 - Comments: 0

Flat diamond chips Kanazawa University and the National Institute of Advanced Industrial Science and Technology (AIST) have developed a process that solves a big issue for diamond semiconductors in power applications. Researchers have developed a water vapor annealing technique that creates atomically flat diamond surfaces. This brings diamond semiconductors one step closer to becoming more... » read more

Power/Performance Bits: Feb. 6

By Jesse Allen - 06 Feb, 2018 - Comments: 0

Recycling cathodes Nanoengineers at the University of California San Diego developed an energy-efficient recycling process that restores used cathodes from spent lithium ion batteries. The process involves harvesting the degraded cathode particles from a used battery and then boiling and heat treating them. In new batteries built with the cathodes, charge storage capacity, charging time and ba... » read more

Manufacturing Bits: Jan. 21

By Mark LaPedus - 21 Jan, 2014 - Comments: 1

Redefining The Kilogram In 2011, the General Conference on Weights and Measures approved a plan to redefine the kilogram and other measurement units. The new definition for the kilogram will be based on the fixed numerical values of Planck’s constant (h), according to the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce. NIST has taken steps t... » read more

Manufacturing Bits: Sept. 24

By Mark LaPedus - 24 Sep, 2013 - Comments: 0

LEGO AFM Students from the University College London (UCL), Tsinghua University and Peking University have built an atomic force microscope (AFM) or nanoscope using toy LEGOs. The AFM, dubbed LEGO2NANO, costs less than $500 to make. In contrast, traditional AFMs cost $100,000 or more. The system was made using LEGOs, Arduino controllers, 3D printed parts and consumer electronics. [captio... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: National Institute of Advanced Industrial Science and Technology

Manufacturing Bits: Sept. 4

Power/Performance Bits: Feb. 6

Manufacturing Bits: Jan. 21

Manufacturing Bits: Sept. 24

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