CHIPS For America’s National Semiconductor Technology Center (NSTC) Program


At this year’s Design Automation Conference, Jay Lewis, director of CHIPS for America National Semiconductor Technology Center (NSTC) Program, gave a presentation on the status and direction of the Center, its priorities for this year and how the NSTC can change the long-term trajectory for innovation. Fig. 1: Dr. Jay Lewis, director of NSTC Program, CHIPS R&D Office at the Dept. o... » read more

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)


A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: "The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into h... » read more

Research Bits: Feb. 13


Fast phase-change memory Researchers from Stanford University, TSMC, National Institute of Standards and Technology (NIST), and University of Maryland developed a new phase-change memory for future AI and data-centric systems. It is based on GST467, an alloy of four parts germanium, six parts antimony, and seven parts tellurium, which is sandwiched between several other nanometer-thin material... » read more

A New Phase-Change Memory For Processing Large Amounts Of Data 


A technical paper titled “Novel nanocomposite-superlattices for low energy and high stability nanoscale phase-change memory” was published by researchers at Stanford University, TSMC, NIST, University of Maryland, Theiss Research and Tianjin University. Abstract: "Data-centric applications are pushing the limits of energy-efficiency in today’s computing systems, including those based on... » read more

An Overview Of Federal Government Semiconductors And Microelectronics Standards Activities (NIST)


A technical paper titled “Semiconductors and Microelectronics Standards, Report of the Semiconductors and Microelectronics Working Group” was published by researchers at the National Institute of Standards and Technology (NIST). Abstract: "This report of the Semiconductors and Microelectronics Working Group of the Interagency Committee on Standards Policy (ICSP) provides an overview of Fe... » read more

Summary Of The Progress In Beta-Phase Gallium Oxide Field-Effect Transistors


A technical paper titled “Progress in Gallium Oxide Field-Effect Transistors for High-Power and RF Applications” was published by researchers at George Mason University and National Institute of Standards and Technology (NIST). Abstract: "Power electronics are becoming increasingly more important, as electrical energy constitutes 40% of the total primary energy usage in the USA and is exp... » read more

2D Computing Magnets For Temperatures Up To 170-Degrees Fahrenheit


A technical paper titled “Magnetic properties of intercalated quasi-2D Fe3-xGeTe2 van der Waals magnet” was published by researchers at University of Texas at El Paso, National Institute of Standards and Technology (NIST), University of Edinburgh, Donostia International Physics Centre (DIPC), Hampton University, and Brookhaven National Laboratory. Abstract: "Among several well-kno... » read more

Predicting Defect Properties In Semiconductors With Graph Neural Networks


A technical paper titled “Accelerating Defect Predictions in Semiconductors Using Graph Neural Networks” was published by researchers at Purdue University, Indian Institute of Technology (IIT) Madras, GE Research, and National Institute of Standards and Technology (NIST). Abstract: "Here, we develop a framework for the prediction and screening of native defects and functional impurities i... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

EUVL: Extreme Ultraviolet Lithography Research, Development, And Manufacturing (NIST)


A special paper titled “Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards” was published by researchers at National Institute of Standards and Technology (NIST). Abstract: "This is the report of a hybrid working group meeting held on April 25, 2023, at the National Institute of Standards and Technology (NIST) in Boulder, C... » read more

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