Samsung's next-gen process, memory and assembly roadmap; 3D metrology In 3D chips/packages; Russian IC sanctions; domain-specific AI chips; CHIPS Act funding; Black Semi's +$200M windfall; HW security failures.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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