Chip Industry Technical Paper Roundup: June 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=436 /] Find more semiconductor research papers here. » read more

Roadmap for AI HW Development, With The Role of Photonic Chips In Supporting Future LLMs (CUHK, NUS, UIUC, Berkeley)


A new technical paper titled "What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips" was published by researchers at The Chinese University of Hong Kong, National University of Singapore, University of Illinois Urbana-Champaign and UC Berkeley. Abstract "Large language models (LLMs) are rapidly pushing the limits of contemporary computing hardware. For example, t... » read more

Research Bits: Apr. 1


Neuro-synaptic RAM Researchers from the National University of Singapore (NUS) and King Abdullah University of Science and Technology (KAUST) found that a standard silicon transistor can function like a biological neuron and synapse when arranged and operated in a specific way. The team was able to replicate both neural firing and synaptic weight changes by adjusting the resistance of the b... » read more

Chip Industry Technical Paper Roundup: Apr. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Scalable And Energy Efficient Solution for Hardware-Based ANNs (KAUST, NUS)


A new technical paper titled "Synaptic and neural behaviours in a standard silicon transistor" was published by researchers at KAUST and National University of Singapore. Abstract "Hardware implementations of artificial neural networks (ANNs)—the most advanced of which are made of millions of electronic neurons interconnected by hundreds of millions of electronic synapses—have achieved ... » read more

Chip Industry Week in Review


Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

Chip Industry Technical Paper Roundup: Nov. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Sustainable Hardware Specialization Through Reconfigurable Logic (NUS, Ghent Univ.)


A  new technical paper titled "Sustainable Hardware Specialization" was published by researchers at National University of Singapore and Ghent University. "We explore sustainable hardware specialization through reconfigurable logic that has the potential to drastically reduce the environmental footprint compared to a sea of accelerators by amortizing its embodied footprint across multiple a... » read more

Chip Industry Week In Review


CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

High-Temperature Processing of Molybdenum Interconnects


A technical paper titled "Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits" was published by researchers at the National University of Singapore, A*STAR, and imec. Abstract "Recent surge in demand for computational power combined with strict constraints on energy consumption requires persistent increase in the density of transistors and memory cells in integrated ... » read more

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