Silicon Photonic Interconnected Chiplets With Computational Network And IMC For LLM Inference Acceleration (NUS)


A new technical paper titled "PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration" was published by researchers at the National University of Singapore. Abstract "This paper presents a 3D-stacked chiplets based large language model (LLM) inference accelerator, consisting of non-volatile in-memory-computing proces... » read more

Research Bits: Nov. 4


Diffusive memristor for artificial neurons Researchers from the University of Southern California, University of Massachusetts, University of California Los Angeles, Syracuse University, and the Air Force Research Laboratory developed artificial neurons that replicate the complex electrochemical behavior of biological brain cells. “Our existing computing systems were never intended to pro... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Nanofabrication Protocol That Allows Patterning Metallic Electrodes on 2D Materials Reliably (KAUST, National University of Singapore)


A new technical paper titled "High-yield photolithography protocol to pattern metallic electrodes on 2D materials without adhesive metallic layers" was published by researchers at KAUST and National University of Singapore. Abstract "When using two-dimensional (2D) materials to build electronic devices, adjacent metallic films need to be deposited to form electrodes. However, weak adhesion ... » read more

Chip Industry Week In Review


The EU’s tariffs on semiconductors will not exceed 15%, according to Trump’s latest trade deal. In addition, the EU committed to purchasing at least $40 billion worth of U.S. AI chips as well as other investments. [FAQ is here.] Lifelines for Intel: Intel inked a deal to sell the U.S. government a 10% non-voting equity stake in its business, worth $8.9 billion. The stake will be fun... » read more

Chip Industry Technical Paper Roundup: July 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=445 /] Find more semiconductor research papers here. » read more

Accelerator Architecture For In-Memory Computation of CNN Inferences Using Racetrack Memory


A new technical paper titled "Hardware-software co-exploration with racetrack memory based in-memory computing for CNN inference in embedded systems" was published by researchers at National University of Singapore, A*STAR, Chinese Academy of Sciences, and Hong Kong University of Science and Technology. Abstract "Deep neural networks generate and process large volumes of data, posing challe... » read more

Chip Industry Technical Paper Roundup: June 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=436 /] Find more semiconductor research papers here. » read more

Roadmap for AI HW Development, With The Role of Photonic Chips In Supporting Future LLMs (CUHK, NUS, UIUC, Berkeley)


A new technical paper titled "What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips" was published by researchers at The Chinese University of Hong Kong, National University of Singapore, University of Illinois Urbana-Champaign and UC Berkeley. Abstract "Large language models (LLMs) are rapidly pushing the limits of contemporary computing hardware. For example, t... » read more

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