tag: National University of Singapore

Power/Performance Bits: July 30
By Jesse Allen - 30 Jul, 2019 - Comments: 0

100GHz transceiver Engineers at the University of California Irvine built a new wireless transceiver that works above 100 gigahertz. The 4.4-millimeter-square silicon chip, called an "end-to-end transmitter-receiver," uses a digital-analog architecture that modulates the digital bits in the analog and radio-frequency domains to process digital signals quickly and energy-efficiently. "We cal... » read more

Power/Performance Bits: Jan. 8
By Jesse Allen - 08 Jan, 2019 - Comments: 0

Ferrimagnetic memory Engineers at the National University of Singapore, Toyota Technological Institute, and Korea University propose a new type of spintronic memory that is 20 times more efficient and 10 times more stable than commercial ones. In spintronic devices, data is stored depending on up or down magnetic states. Current devices based on ferromagnets, however, suffer from a few issu... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Nov, 2018 - Comments: 0

Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for the sale of the intellectual-property and certain assets associated with its semiconductor test business to Advantest for $185 million in cash. The sale additionally includes a $30 million earn-... » read more

Power/Performance Bits: May 22
By Jesse Allen - 22 May, 2018 - Comments: 0

Sensing without battery power Engineers at the National University of Singapore developed an IoT-focused sensor chip that can continue operating when its battery runs out of energy. The chip, BATLESS, uses a power management technique that allows it to self-start and continue to function under dim light without any battery assistance. The chip can operate in two different modes: minimum-ene... » read more

Uncertainty Grows For 5nm, 3nm
By Mark LaPedus - 19 Dec, 2016 - Comments: 4

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

Power/Performance Bits: July 26
By Jesse Allen - 26 Jul, 2016 - Comments: 0

Flexible MRAM Researchers from the National University of Singapore, Yonsei University, Ghent University and Singapore's Institute of Materials Research and Engineering embedded a magnetic memory chip on a plastic material, flexible enough to be bent into a tube. The new device operates on magnetoresistive random access memory (MRAM), which uses a magnesium oxide (MgO)-based magnetic tunn... » read more

Power/Performance Bits: May 10
By Jesse Allen - 10 May, 2016 - Comments: 0

Non-toxic thin-films A team at Australia's University of New South Wales achieved the world's highest efficiency using flexible solar cells that are non-toxic and cheap to make, with a record 7.6% efficiency in a 1cm2 area thin-film CZTS cell. Unlike its thin-film competitors, CZTS cells are made from abundant materials: copper, zinc, tin and sulphur, and has none of the toxicity problems... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2015 - Comments: 0

Printing hair Using a low-cost, 3D printing technique, Carnegie Mellon University has found a way to produce hair-like strands and fibers. The printer produces plastic hair strand by strand. It takes about 20-25 minutes to generate hair on 10 square millimeters. A video can be seen here. [caption id="attachment_24544" align="alignleft" width="300"] 3D printed hair (Photo: Carnegie Mellon... » read more

The Search For The Next Transistor
By Mark LaPedus - 20 Feb, 2014 - Comments: 3

In the near term, the leading-edge chip roadmap looks fairly clear. Chips based on today’s finFETs and planar fully depleted silicon-on-insulator (FDSOI) technologies are expected to scale down to the 10nm node. But then, the CMOS roadmap becomes foggy at 7nm and beyond. The industry has been exploring a number of next-generation transistor candidates, but suddenly, a few technologies are ... » read more

Manufacturing Bits: Jan. 7
By Mark LaPedus - 07 Jan, 2014 - Comments: 0

Climbing Terminator Robots Simon Fraser University has developed a family of climbing robots that mimic the stickiness of gecko lizard feet. Based on a “footpad terminator” adhesive technology, the robots could be used in space missions and on Earth. The climbing robot, called Abigaille, features six legs. This allows the robots to crawl on vertical and horizontal structures. The techno... » read more

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