tag: Netronome

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Sep, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

New Technologies To Support 3D-ICs
By Brian Bailey - 04 Sep, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

EDA Gears Up For 3D
By Brian Bailey - 26 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Waiting For Chiplet Interfaces
By Brian Bailey - 13 Jun, 2019 - Comments: 0

There aren't many success stories related to chiplets today for a very simple reason—there are few standard interfaces defined for how to connect them. In fact, the only way to use them is to control both sides of the interface with a proprietary interface and protocol. The one exception is the definition of HBM2, which enables large quantities of third-party DRAM to be connected to a logi... » read more

Chiplet Momentum Builds, Despite Tradeoffs
By Brian Bailey - 13 May, 2019 - Comments: 0

Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

Creating A Roadmap For Hardware Security
By Kevin Fogarty and Ed Sperling - 02 May, 2019 - Comments: 0

The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

Making Chip Packaging Simpler
By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Getting Down To Business On Chiplets
By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Nov, 2018 - Comments: 0

Chipmakers A U.S. federal grand jury has indicted Chinese DRAM maker Jinhua Integrated Circuit Co. (JHICC), Taiwan's UMC and three individuals, charging them with alleged crimes related to a conspiracy to steal, convey, and possess stolen trade secrets from Micron Technology for the benefit of a company controlled by the China government. In addition, the U.S. filed a civil lawsuit seeking... » read more

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