The X Factor


By Ed Sperling The number of unknowns is growing in every segment of SoC design all the way through manufacturing, raising the stakes between reliability and the tradeoffs necessary to meet market windows. Tools are available to deal with some of these unknowns, or X’s, but certainly not all of them. Moreover, no single tool can handle all unknowns, some of which can build upon other unkn... » read more

The Analyst View


By Kurt Shuler I was fortunate to be able to meet with 13 different semiconductor industry analysts from eight different companies over the last two weeks. Our conversations ranged from the current state of the semiconductor industry to future software architecture trends. I want to take this opportunity to thank them once again for the exchange of ideas and the opportunity to learn from them.... » read more

The Smartphonification Of Things


By Ann Steffora Mutschler The term, ‘Internet of Things,’ was first coined more than a decade ago by technology visionary Kevin Ashton but has slowly trickled down to the world of chip design and is now mentioned constantly in conversation. The reason is simple: System-level design tools are getting sophisticated enough to handle the intricacies required by devices in an Internet of ... » read more

Version Control


By Ed Sperling & Ann Steffora Mutschler One of the biggest impediments to progress in semiconductor design is progress itself—version after version of specifications, formats and increasingly IP. In fact, there are so many different versions, some of which conflict directly with each other, that it may take months or even years before some customers adopt new products. Much has ... » read more

Let The IP Wars Begin


y Ed Sperling Nature abhors a vacuum. Customers abhor a monopoly. It appears both problems are now being solved in the EDA world—assuming approval by regulatory agencies, of course. There have been two concerns facing chipmakers in regards to third-party IP. One is political. Most large companies spent millions of dollars and thousands of frustrating man-hours developing their own interna... » read more

The Rise Of Layout-Dependent Effects


By Ann Steffora Mutschler Designing for today’s advanced semiconductor manufacturing process nodes brings area, speed, power and other benefits but also new performance challenges as a result of the pure physics of running current through tiny wires. Layout-dependent effects (LDE), which emerged at 40nm and are having a larger impact at 28 and 20nm, introduce variability to circuit ... » read more

Advanced SoC Interconnect IP


By Kurt Shuler I am thoroughly enjoying 2013. That’s because there seems to be a lot more reason for optimism this year than last year. But before we let go of 2012, it’s important to reflect on the past year and see what it can teach us so we can make better business decisions moving forward. The one lesson learned is that flexibility for SoC designs is increasingly more important. In ... » read more

Power Benefits Of Modular Interconnect Design Using Network-On-Chip Technology


The system-on-chip (SoC) interconnect spans the entire floorplan of a chip and consumes a significant portion of the power. The interconnects of today’s SoCs are a distributed architecture of switches, buffers, firewalls, register slices, and clock and power domain crossings. One approach is to implement these units modularly with a simple, universal transport protocol between all units. This... » read more

On-Chip Communications Survey Results


This comprehensive report takes a closer look at general technology trends and factors associated with OCCNs, such as core target speeds. It investigates the most popular OCCN topologies being considered for implementation in multi-core SoCs, including networks-on-chip (NoCs), crossbars, peripheral interconnect, and multi-layer bus matrices. It then dives deeper into NoCs, including analyzing a... » read more

From Hype To Reality


By Kurt Shuler My purpose in this article is to explain Gartner Research’s Hype Cycle and relate it to the Technology Adoption Lifecycle popularized by Geoffrey Moore’s book, “Crossing the Chasm.” These two models can be used together to provide a combined picture of market expectations and expected technology adoption rates, but people often get the timeframes and takeaways wrong. So ... » read more

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