Chip Industry Technical Paper Roundup: April 30


These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

In-Memory Computing: Techniques for Error Detection and Correction


A new technical paper titled "Error Detection and Correction Codes for Safe In-Memory Computations" was published by researchers at Robert Bosch, Forschungszentrum Julich, and Newcastle University. Abstract "In-Memory Computing (IMC) introduces a new paradigm of computation that offers high efficiency in terms of latency and power consumption for AI accelerators. However, the non-idealities... » read more

Chip Industry’s Technical Paper Roundup: August 22


New technical papers added to Semiconductor Engineering’s library this week. [table id=129 /]   More Reading Technical Paper Library home » read more

EDA Tool To Detect SW-HW Vulnerabilities Ensuring Data Confidentiality In A RISC-V Architecture


A technical paper titled “SoftFlow: Automated HW-SW Confidentiality Verification for Embedded Processors” was published by researchers at RWTH Aachen University, Robert Bosch, and Newcastle University. Abstract: "Despite its ever-increasing impact, security is not considered as a design objective in commercial electronic design automation (EDA) tools. This results in vulnerabilities being... » read more

Power/Performance Bits: May 11


Light-emitting silicon Researchers from the Eindhoven University of Technology, Friedrich-Schiller-Universität Jena, Johannes Kepler University, and Technische Universität München developed a silicon germanium alloy that can emit light, paving the way for a silicon laser that could be integrated for on-chip and chip-to-chip communication. Bulk silicon is extremely inefficient at emitting... » read more