tag: NI

The Week In Review: Manufacturing
By Mark LaPedus - 03 Mar, 2017 - Comments: 2

SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

Digital States, Voltage Levels, And Logic Families
By NI - 06 Feb, 2017 - Comments: 0

Learn about digital states, voltage logic levels, and logic level families for digital signals. This tutorial is part of the Instrument Fundamentals series. To read more, click here. » read more

ATO 2017: Driven by Necessity
By James Truchard - 06 Feb, 2017 - Comments: 0

In the aerospace and defense industry, reducing release cycles and preventing program delays have become increasingly difficult. In automotive, consumer demands are driving up test complexity and introducing new costs in areas like infotainment. In response, test managers must find affordable ways to incorporate RF testing for wireless signals and machine vision testing for assisted parking to ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jan, 2017 - Comments: 0

Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Jan, 2017 - Comments: 0

Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

The Week In Review: IoT
By Jeff Dorsch - 13 Jan, 2017 - Comments: 0

R&D National Instruments this week opened the NI Industrial Internet of Things Lab at its headquarters in Austin, Texas. NI and Real-Time Innovations are co-leading the Industrial Internet Consortium’s Industrial Internet of Things Microgrid Testbed, which will be hosted at the NI Industrial Internet of Things Lab. The testbed uses the Data Distribution Service standard and is working to dev... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Jan, 2017 - Comments: 0

Chipmakers and OEMs Samsung NEXT, formerly called the Samsung Global Innovation Center, has announced the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund. The idea is to fund early stage startups. What’s next in consumer electronics? At CES 2017, Samsung unveiled a wide range of new products, such as quantum dot TVs, smart appliances, gaming laptops and s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Dec, 2016 - Comments: 0

Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 17 Nov, 2016 - Comments: 0

We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

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