tag: NI

Advanced Features Of High-Speed Digital I/O Devices: Timing
By NI - 14 Jan, 2020 - Comments: 0

In digital communication, timing is the most essential element. Any kind of violation to timing could cause you to transmit or receive incorrect data. As instruments and communication rates get faster, timing becomes even more vital, as even the smallest of changes in edges (in the pico-second range), could cause incorrect tests and communication failures. In the following paragraphs, discover ... » read more

Cadence To Buy NI’s AWR Unit For $160M
By Ed Sperling - 02 Dec, 2019 - Comments: 0

Cadence signed a deal to buy National Instruments' AWR business unit for about $160 million in cash, a move that Cadence describes as a way to broaden its market into intelligent system design. AWR's strength is high-frequency RF design automation tools, particularly in the millimeter wave and microwave spectrums, which are critical for radar and 5G. Both of those technologies are expected t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

How 5G Affects Test
By Ed Sperling - 11 Nov, 2019 - Comments: 0

David Hall, head of semiconductor marketing at National Instruments, talks with Semiconductor Engineering about architectural changes to infrastructure due to the rollout of 5G and how the move from macrocells to small cells is changing test requirements.         Subscribe to Semiconductor Engineering's YouTube Channel here » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Nov, 2019 - Comments: 0

Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Sep, 2019 - Comments: 0

Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Under The Hood Of NI Linux Real-Time
By NI - 09 Sep, 2019 - Comments: 0

The NI LabVIEW Real-Time Module supports the NI Linux Real-Time OS, available on select NI hardware. In this article, learn about specific new features and advanced topics to get the most out of NI Linux Real-Time for your application. To read more, click here. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Solving 5G’s Thorniest Issues
By Ed Sperling - 01 Aug, 2019 - Comments: 0

5G rollouts are beginning to hit the market, accompanied by a long list of unsolved technical and business issues surrounding this next-generation wireless technology. But progress is being made on some of the key challenges facing this technology, even though not all of those solutions will be in place at launch. The real challenges are with millimeter-wave implementations of 5G, which oper... » read more

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