tag: Nordson

How Hardware Can Bias AI Data
By Ed Sperling - 10 Sep, 2019 - Comments: 1

Clean data is essential to good results in AI and machine learning, but data can become biased and less accurate at multiple stages in its lifetime—from moment it is generated all the way through to when it is processed—and it can happen in ways that are not always obvious and often difficult to discern. Blatant data corruption produces erroneous results that are relatively easy to ident... » read more

Test On New Technology’s Frontiers
By Ed Sperling And Susan Rambo - 10 Sep, 2019 - Comments: 2

Semiconductor testing is getting more complicated, more time-consuming, and increasingly it requires new approaches that have not been fully proven because the technologies they are addressing are so new. Several significant shifts are underway that make achieving full test coverage much more difficult and confidence in the outcome less certain. Among them: Devices are more connected an... » read more

Autonomous Vehicles Are Reshaping The Tech World
By Kevin Fogarty - 05 Sep, 2019 - Comments: 0

The effort to build cars that can drive themselves is reshaping the automotive industry and its supply chain, impacting everything from who defines safety to how to ensure quality and reliability. Automakers, which hardly knew the names of their silicon suppliers a couple of years ago, are now banding together in small groups to share the costs and solve technical challenges that are well be... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

Advanced Packaging Options Increase
By Ed Sperling - 19 Aug, 2019 - Comments: 0

Designing, integrating and assembling heterogeneous packages from blocks developed at any process node or cost point is proving to be far more difficult than expected, particularly where high performance is one of the main criteria. At least part of the problem is there is a spectrum of choices, which makes it hard to achieve economies of scale. Even where there is momentum for a particular ... » read more

GaN Versus Silicon For 5G
By Kevin Fogarty - 15 Aug, 2019 - Comments: 0

The global race to launch 5G mmWave frequencies could provide a long-anticipated market opportunity for gallium nitride (GaN) as an alternative to silicon. GaN is more power-efficient than silicon for 5G RF. In fact, GaN has been the heir apparent to silicon in 5G power amplifiers for years, especially when it comes to mmWave 5G networks. What makes it so attractive is its ability to efficie... » read more

Wanted: More Fab Tool Part Standards
By Mark LaPedus - 15 Aug, 2019 - Comments: 0

As chipmakers ramp up the next wave of processes and grapple with how to reduce defect levels, they are encountering problems from an unlikely source—components inside of the fab equipment. Defects are unwanted deviations in chips, which impact yields and device performance. Typically, they are caused by an unforeseen glitch during the process flow. But a lesser-known problem involves defe... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Using Better Data To Shorten Test Time
By Ed Sperling - 06 Aug, 2019 - Comments: 1

The combination of machine learning plus more sensors embedded into IC manufacturing equipment is creating new possibilities for more targeted testing and faster throughput for fabs and OSATs. The goal is to improve quality and reduce the cost of manufacturing complex chips, where time spent in manufacturing is ballooning at the most advanced nodes. As the number of transistors on a die incr... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Aug, 2019 - Comments: 0

Trade wars Talks between the United States and China continue to stall and the two nations are still embroiled in a trade war. So this week, U.S. President Donald Trump would like to impose a 10% tariff on the remaining $300 billion list of China-based imports starting Sept. 1, according to a report from Reuters. This in turn will impact the electronics and IC industries. In response to the... » read more

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