tag: North Carolina State University

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Power/Performance Bits: Jan. 5
By Jesse Allen - 05 Jan, 2016 - Comments: 0

A foggy consortium Scientists at Princeton University, ARM, Cisco, Dell, Intel, and Microsoft formed a global effort to develop architectures and tools to further "fog computing" and networks, which aim to harness connected devices' own computing, sensing and storage power to form edge networks that meet most of the demand of user devices that are at the periphery of a more centralized netwo... » read more

System Bits: Dec. 8
By Ann Mutschler - 08 Dec, 2015 - Comments: 0

Untraceable text-messaging Anonymity networks, like Tor, which sit on top of the public Internet, were meant to conceal Web-browsing habits but recent research by MIT has shown that adversaries can infer a great deal about the sources of supposedly anonymous communications by monitoring data traffic though a few well-chosen nodes in an anonymity network. To fight this growing concern, a tea... » read more

Can Nano-Patterning Save Moore’s Law?
By Mark LaPedus - 19 Nov, 2015 - Comments: 0

For years the academic community has explored a novel technology called selective deposition. Then, more than a year ago, Intel spearheaded an effort to bring the technology from the lab to the fab at 7nm or 5nm. Today, selective deposition is still in R&D, but it is gaining momentum in the industry. With R&D funding from Intel and others, selective deposition, sometimes called ALD-e... » read more

System Bits: Oct. 6
By Ann Mutschler - 06 Oct, 2015 - Comments: 0

Tiny graphene pores for sensors In fundamental work that will likely guide current and future graphene membrane design principles in years to come, MIT researchers have created tiny pores in single sheets of graphene that have an array of preferences and characteristics similar to those of ion channels in living cells, and which could be useful as sensors. The researchers pointed out that e... » read more

Power/Performance Bits: June 23
By Jesse Allen - 23 Jun, 2015 - Comments: 0

Printing 3D circuits from wood Researchers at Chalmers created three-dimensional objects made entirely of cellulose for the first time with the help of a 3D-bioprinter. They also added carbon nanotubes to create electrically conductive material. The difficulty using cellulose derived from wood in additive manufacturing is that cellulose does not melt when heated. Therefore, the 3D printer... » read more

New Patterning Paradigm?
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chip scaling is becoming more difficult at each process node, but the industry continues to find new and innovative ways to solve the problems at every turn. And so chipmakers continue to march down the various process nodes. But the question is for how much longer? In fact, at 16nm/14nm and beyond, chipmakers are finding new and different challenges, which, in turn, could slow IC scaling or br... » read more

Issues And Options At 5nm
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

Mobile Packaging Market Heats Up
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to cram more chip functions in smaller IC packages, but there are some challenges in the arena. In fact, there are signs that the mainstream packaging technology for mobiles is running out of steam. For some time, mobile products have incorporated a technology called package-on-package (PoP), which u... » read more

Power/Performance Bits: Oct. 22
By Ann Mutschler - 22 Oct, 2013 - Comments: 0

Thermal emitter improves solar cell efficiency Stanford University scientists have created a heat-resistant thermal emitter -- an element used in specialized solar cells -- that could significantly improve the efficiency of the cells. The heat-resistant thermal emitter is designed to convert heat from the sun into infrared light that can be absorbed by solar cells to make electricity – a tec... » read more

Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy