Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Research Bits: Mar. 9


Low noise clock generator Researchers from Ulsan National Institute of Science and Technology (UNIST) designed a low power semiconductor circuit capable of generating high-quality clock signals with significantly reduced noise levels. The injection-locked clock multiplier (ILCM) circuit uses a simplified design based on a ring voltage-controlled oscillator (VCO). It integrates a frequency t... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Digital Memristor-Based PIM From A Device And Reliability View (Northwestern, Technion)


A new technical paper titled "A Comparative Study of Digital Memristor-Based Processing-In-Memory from a Device and Reliability Perspective" was published by researchers at Northwestern University and  Technion – Israel Institute of Technology. Abstract "As data-intensive applications increasingly strain conventional computing systems, processing-in-memory (PIM) has emerged as a promis... » read more

Research Bits: August 19


Co-packaged optics Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to co-package photonic and electronic chips that uses existing automated pick-and-place assembly equipment in traditional fabs along with a less-expensive passive alignment process. “We’ve developed a packaging design [for integrating photonics with el... » read more

Chip Industry Week in Review


The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

Chip Industry Technical Paper Roundup: July 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=426 /] Find more semiconductor research papers here. » read more

Viability of aZnMIm As A Resist For EUV Lithography (Johns Hopkins, Northwestern, Intel et al.)


A new technical paper (preprint) titled "Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous Zeolitic Imidazolate Resists Deposited by Atomic/Molecular Layer Deposition" was published by researchers at Johns Hopkins University, Northwestern University, Intel Corporation, Bruker Nano, EUV Tech and Lawrence Berkeley National Lab. The paper states "This study demonstr... » read more

Wearable Connectivity, AI Enable New Use Cases


The sensing and processing technology used in smart phones, watches, and rings is starting to be being deployed in a wide variety of wearable devices, ranging from those that fill the gap between sports and med tech, to haptic devices to assist the visually impaired and AR/VR glasses. Emerging applications include payment, building, and factory wearables. Most of these devices process signal... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

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