Chip Industry Technical Paper Roundup: April 8

Verification of memory consistency; mitigating IR drop; IBM’s quantum memory; Rowhammer on AMD; new MRAM material structure; hybrid all-optical switching devices w/2D; n-type diamond MOSFETs; differential privacy by low-power SRAM.


New technical papers recently added to Semiconductor Engineering’s library.

Technical Paper Research Organizations
Power Sub-Mesh Construction in Multiple Power Domain Design with IR Drop and Routability Optimization Intel Corporation and National Taiwan University
ZenHammer: Rowhammer Attacks on AMD Zen-based Platforms ETH Zurich
QED: Scalable Verification of Hardware Memory Consistency Purdue University
High-threshold and low-overhead fault-tolerant quantum memory IBM Quantum
Two Birds with One Stone: Differential Privacy by Low-power SRAM Memory North Carolina State University, University of South Alabama, and University of Tennessee
Electrically Controlled All-Antiferromagnetic Tunnel Junctions on Silicon with Large Room-Temperature
Northwestern University, Universitat Jaume, California State University Northridge, Argonne National Lab, Politecnico diBari, and University of Messina
Hybrid silicon all-optical switching devices integrated with two-dimensional material RIKEN, National Institute of Advanced Industrial Science and Technology (AIST), and Keio University
High-Temperature and High-Electron Mobility Metal-Oxide-Semiconductor Field-Effect Transistors Based on N-Type Diamond National Institute for Materials Science (Japan)

Find last week’s technical paper additions here.

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