Enabling Advanced Devices With Atomic Layer Processes


Atomic layer deposition (ALD) used to be considered too slow to be of practical use in semiconductor manufacturing, but it has emerged as a critical tool for both transistor and interconnect fabrication at the most advanced nodes. ALD can be speeded up somewhat, but the real shift is the rising value of precise composition and thickness control at the most advanced nodes, which makes the ext... » read more

Chip Industry Technical Paper Roundup: April 8


New technical papers recently added to Semiconductor Engineering’s library. [table id=214 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

New Memory Architecture For Local Differential Privacy in Hardware


A technical paper titled "Two Birds with One Stone: Differential Privacy by Low-power SRAM Memory" was published by researchers at North Carolina State University, University of South Alabama, and University of Tennessee. Abstract "The software-based implementation of differential privacy mechanisms has been shown to be neither friendly for lightweight devices nor secure against side-channe... » read more

Week In Review: Manufacturing, Test


The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

Chip Industry’s Technical Paper Roundup: July 12


New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs) 


A technical paper titled "All Electrohydrodynamic Printed Flexible Organic Thin Film Transistors" was published by researchers at North Carolina State University. Abstract: "The demand of cost-effective fabrication of printed flexible transistors has dramatically increased in recent years due to the need for flexible interface devices for various application including e-skins, wearables, and ... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Design of Selective Deposition Processes For Nanoscale Electronic Devices


A technical paper titled “Quantified Uniformity and Selectivity of TiO2 Films in 45-nm Half Pitch Patterns Using Area-Selective Deposition Supercycles” was published by researchers at IMEC, North Carolina State University, and KU Leuven. Abstract: "Area-selective deposition (ASD) shows great promise for sub-10 nm manufacturing in nanoelectronics, but significant challenges remain in scali... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

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