Chip Industry’s Technical Paper Roundup: Feb. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=82 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

HW-SW Co-Design Solution For Building Side-Channel-Protected ML Hardware


A technical paper titled "Hardware-Software Co-design for Side-Channel Protected Neural Network Inference" was published (preprint) by researchers at North Carolina State University and Intel. Abstract "Physical side-channel attacks are a major threat to stealing confidential data from devices. There has been a recent surge in such attacks on edge machine learning (ML) hardware to extract the... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17


New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Technique For Printing Electronic Circuits Onto Curved & Corrugated Surfaces Using Metal Nanowires (NC State)


A technical paper titled "Curvilinear soft electronics by micromolding of metal nanowires in capillaries" was published by researchers at North Carolina State University. “We’ve developed a technique that doesn’t require binding agents and that allows us to print on a variety of curvilinear surfaces,” says Yuxuan Liu, first author of the paper and a Ph.D. student at NC State in this ... » read more

Research Bits: Jan. 9


Making stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Purdue University, and Texas Heart Institute developed a new method to make soft, stretchable transistors easier and cheaper to manufacture. The lateral phase separation induced micromesh (LPSM) process involves mixing a semiconductor and an elastomer and spin coating the liquid mixture pre... » read more

Research Bits: Jan. 3


Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Week In Review: Design, Low Power


Revenue for the top 10 IC design houses globally hit US$ 39.6 billion in 2Q22, a 32% growth over the prior year, according to a Trendforce report. The firm contends this growth trend will be difficult to maintain due to the high preceding base period and overall worse market conditions. Renesas introduced a RISC-V MCU specifically optimized for advanced motor control systems. The new ASSP in... » read more

Research Bits: Aug. 16


Protein-based circuits Researchers from North Carolina State University and University of Cambridge created self-assembled, protein-based circuits that can perform simple logic functions and take advantage of an electron’s properties at quantum scales. A challenge in creating molecular circuits is the unreliability as circuit size decreases. At the quantum scale, electrons behave like wav... » read more

Research Bits: Aug. 8


Speeding NVM encryption Researchers from North Carolina State University propose a way to speed up encryption and file system performance for non-volatile memory (NVM). “NVMs are an emerging technology that allows rapid access to the data, and retains data even when a system crashes or loses power,” said Amro Awad, an assistant professor of electrical and computer engineering at North C... » read more

Silicon-based Power Semis Face Challenges


Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

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