GPU-Based Computing In Photomask Manufacturing

By Aki Fujimura - 28 Mar, 2016 - Comments: 0

Graphical-processing unit (GPU)-accelerated computing has reached maturity for professional, scientific computing applications. One example of this is the recent GPU-accelerated thermal application for semiconductor photomask manufacturing, which is used in 24/7 manufacturing environments. GPU-accelerated computing won’t be a universal panacea for the semiconductor industry’s “need for sp... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 25 Mar, 2016 - Comments: 0

Chipmakers In a blog, GlobalFoundries discussed the global push towards 5G or fifth-generation wireless networks. Samsung Electronics Australia has announced the creation of brainBAND, a wearable technology designed to facilitate research into concussions in sports. In the prototype, a headband houses sensors at the back of the head that measure the force of an impact. This information wou... » read more

Tech Talk: GPU-Accelerated Photomasks

By Ed Sperling - 22 Mar, 2016 - Comments: 0

Noriaki Nakayamada, group manager for the data control engineering group in NuFlare's Mask Lithography engineering Department, talks about what's changing on the mask side, where the trouble spots are, and how to deal with them at advanced process nodes. [youtube vid=f8PixJMadXw] » read more

Multi-Beam Market Heats Up

By Mark LaPedus - 17 Mar, 2016 - Comments: 3

The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market. In one surprising move, [getentity id="22846" e_name="Intel"] is in the process of acquiring IMS Nanofabrication, a [gettech id="31058" t_name="multi-beam e-beam"] equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer t... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

5nm Fab Challenges

By Mark LaPedus - 21 Jan, 2016 - Comments: 2

At a recent event, Intel presented a paper that generated sparks and fueled speculation regarding the future direction of the leading-edge IC industry. The company described a next-generation transistor called the nanowire FET, which is a finFET turned on its side with a gate wrapped around it. Intel’s nanowire FET, sometimes called a gate-all-around FET, is said to meet the device require... » read more

Fab Tool Biz Looks Cloudy

By Mark LaPedus - 17 Dec, 2015 - Comments: 1

Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

Gaps Remain For EUV Masks

By Mark LaPedus - 02 Oct, 2015 - Comments: 4

Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come together before EUV is inserted into mass production at that node. First, the EUV source must generate more power. Second, tool uptime must improve. Third, the industry needs better EUV resists. A... » read more

Finding Defects Is Getting Harder

By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Chipmakers are plotting out a strategy to scale the transistor to 10nm and beyond. Migrating to these nodes presents a number of challenges, but one issue is starting to gain more attention in the market—killer defects. Defects have always been problematic in the yield ramp for chip designs, but the ability to find them is becoming more difficult and expensive at each node. And it will be... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 28 Aug, 2015 - Comments: 0

NuFlare Technology wants to enter a new market. The e-beam giant and NGR are jointly collaborating on a development program for next-generation electron-beam wafer inspection and metrology. It’s unclear if NuFlare is developing a single- or multi-beam tool, however. Don’t look now, but a fab tool downturn could be on the horizon. This comes amid a slowdown in PCs, tablets and smartphone... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NuFlare

GPU-Based Computing In Photomask Manufacturing

The Week In Review: Manufacturing

Tech Talk: GPU-Accelerated Photomasks

Multi-Beam Market Heats Up

The Week In Review: Manufacturing

5nm Fab Challenges

Fab Tool Biz Looks Cloudy

Gaps Remain For EUV Masks

Finding Defects Is Getting Harder

The Week In Review: Manufacturing