Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

Processing-Using-DRAM: Attaining High-Performance Via Dynamic Precision Bit-Serial Arithmetic (ETH Zurich, et al.)


A new technical paper titled "Proteus: Achieving High-Performance Processing-Using-DRAM via Dynamic Precision Bit-Serial Arithmetic" was published by researchers at ETH Zurich, Cambridge University, Universidad de Córdoba, Univ. of Illinois Urbana-Champaign and NVIDIA Research. Abstract "Processing-using-DRAM (PUD) is a paradigm where the analog operational properties of DRAM structures ... » read more

Chip Industry Week In Review


The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Global IC Fabs And Facilities Report: 2024


The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

Chip Industry Technical Paper Roundup: Jan. 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

Chip Industry Week In Review


GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

Geometric-Aware Model Merging Approach To Enhance Instruction Alignment in Chip LLMs (Nvidia)


A new technical paper titled "ChipAlign: Instruction Alignment in Large Language Models for Chip Design via Geodesic Interpolation" was published by researchers at NVIDIA Research. Abstract: "Recent advancements in large language models (LLMs) have expanded their application across various domains, including chip design, where domain-adapted chip models like ChipNeMo have emerged. However, ... » read more

Chip Industry Week In Review


Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Startup Funding: Q4 2024


The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 million in the largest round for a chip design startup this year. It was far from the only AI startup, however, as several companies gathered support for neuromorphic designs focused on ultra-low po... » read more

Chip Industry Week in Review


Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

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