tag: Nvidia

Chip Industry Technical Paper Roundup: August 13
By Linda Christensen - 13 Aug, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=249 /] More ReadingTechnical Paper Library home   » read more

Analog Consolidation Spurs New Round Of Startups
By Bryon Moyer - 08 Aug, 2024 - Comments: 0

A new wave of startups is rising to meet the growing need for specialized analog customization in chip design projects, opening the door to more affordable custom designs. These startups are breathing new life into a sector, which as a result of consolidation has favored only the largest chipmakers. As larger analog companies acquire smaller ones, many companies that were previously engaged ... » read more

Power Delivery Challenged By Data Center Architectures
By Ann Mutschler - 08 Aug, 2024 - Comments: 0

Processor and data center architectures are changing in response to the higher voltage needs of servers running AI and large language models (LLMs). At one time, servers drew a few hundred watts for operation. But over the past few decades that has changed drastically due to a massive increase in the amount of data that needs to be processed and user demands to do it more quickly. NVIDIA's G... » read more

Secure Low-Cost In-DRAM Trackers For Mitigating Rowhammer (Georgia Tech, Google, Nvidia)
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "MINT: Securely Mitigating Rowhammer with a Minimalist In-DRAM Tracker" was published by researchers at Georgia Tech, Google, and Nvidia. Abstract "This paper investigates secure low-cost in-DRAM trackers for mitigating Rowhammer (RH). In-DRAM solutions have the advantage that they can solve the RH problem within the DRAM chip, without relying on other parts of ... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Capturing Knowledge Within LLMs
By Brian Bailey - 25 Jul, 2024 - Comments: 0

At DAC this year, there was a lot of talk about AI and the impact it is likely to have. While EDA companies have been using it for optimization and improving iteration loops within the flow, the end users have been concentrating on how to use it to improve the user interface between engineers and tools. The feedback is very positive. Large language models (LLMs) have been trained on a huge a... » read more

Legacy Process Nodes Going Strong
By Bryon Moyer - 23 Jul, 2024 - Comments: 0

While all eyes tend to focus on the leading-edge silicon nodes, many mature nodes continue to enjoy robust manufacturing demand. Successive nodes stopped reducing die cost at around the 20nm node. “In the finFET era of processes, esoteric process requirements necessary to move technology forward with each generation have added significant cost and complexity,” explained Andrew Appleby, p... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Heat-Related Issues Impact Reliability In Advanced IC Designs
By Ann Mutschler - 18 Jul, 2024 - Comments: 1

Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads. All types of circuitry are vulnerable to thermal effects. It can slow the movement of the electrons through wires, cause electromigration that shortens the lifespan of... » read more

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy