A Node By Any Other Name


Have you ever wondered what gives a particular CMOS technology node its name? When we talk about 20nm, 16nm or 14nm, what exactly does that number in front of the “nm” mean anyway? Is it the first layer metal half-pitch or the gate length (and while we’re at it, is that the printed gate length, the physical gate length, or the effective gate length)? The half-pitch refers to half the m... » read more

Real Countries Have Fabs


Persistent rumblings about the sale of IBM’s semiconductor unit might have seemed absurd a couple decades ago—before IBM sold off its PC unit to Lenovo and lost the gaming chip business to AMD’s x86 chips—but no one is scoffing at the possibility these days. The reality is that IBM will never reach the volume necessary to be the No. 1 or No. 2 player in its segment. It’s not even i... » read more

Time To Revisit 2.5D And 3D


Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

Blog Review: April 16


Cadence’s Richard Goering attended a workshop on “extreme” scale design automation, which looked at where else EDA tools can be used—such as intelligent traffic lights. At least there are well-defined use cases. Mentor’s Nazita Saye has compiled five predictions from the 1964 New York World’s Fair that are worth revisiting. Three of them came true. Check out the ones that didn’... » read more

Favorite Forecast Fallacies


It’s difficult to make predictions, especially about the future. – An Old Danish Proverb. The GSA Silicon Summit was held on Thursday, April 10th at the Computer History Museum in Mountain View, CA. The opening panel session was entitled Advancements in Nanoscale Processing. The panelists were Rob Aitken (ARM), Adam Brand (Applied Materials), Peter Huang (TSMC), Nick Kepler (VLSI Researc... » read more

Blog Review: March 19


ARM’s Diya Soubra has discovered an interesting term in relation to the Internet of Things: Compound Applications. Will that make the IoT more compelling? Mentor’s Colin Walls points to some less obvious reasons for choosing a processor. No. 4 on his list is particularly noteworthy. Synopsys’ Mick Posner has some thoughts about wearable computing prototypes. Check out the top pho... » read more

The Good Kind Of Regulation


This month I’m taking a page from the Editor’s book, (actually the title for the article here came from Ed Sperling) and I decided that the above title would be fitting for this article. Last September we took a look at IBM’s presentations on their POWER8 processor from HotChips. One of the multiple new interesting aspects of this design was the use of many on-chip integrated voltage regu... » read more

Blog Review: Feb. 19


Adding a GUI to an RTOS? It may sound counterintuitive, but Mentor’s Colin Walls looks at why and where they’re being used. Cadence’s Richard Goering infuses some humor into signal integrity, which could definitely use it, courtesy of Eric Bogatin and Henny Youngman. When was the last time you saw a signal integrity engineer rolling on the floor in hysterical laughter? Well, there’s ... » read more

28nm Powers TSMC Forward (Part Deux)


TSMC’s financial results for the 4th Quarter of 2013 and for the full year were announced just a few weeks ago, with TSMC stating it had again achieved record sales and profits. TSMC continues to own the 28nm foundry market. TSMC a year ago stated plans to have 20nm as its next technology node in production in 2014 and it looks to be delivering on this projected claim with the announcement th... » read more

The Other Side Of Formal


It’s natural to think of formal analysis as a ruthlessly effective bug hunter and verification tool. But as the following case study from Homayoon Akhiani, presented at the Jasper Users Group (JUG) meeting shows, customers are using this approach to increase their SoC’s performance in ways that are very visible to the end-user of the part. Such visible improvements — in this case, minimiz... » read more

← Older posts Newer posts →