tag: Onto Innovation

Battling Over Shrinking Physical Margin In Chips
By Ed Sperling - 31 Jul, 2023 - Comments: 0

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

DAC/SEMICON West 2023 Roundup
By The SE Staff - 17 Jul, 2023 - Comments: 0

The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year's SEMICON West, both in presentations and one-on-one discussions. Challenges range from sharing data securely across a highly integrated supply chain, particularly in light of heterogeneous integration, security concerns, and the increased use of AI, as well as concerns about the robus... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 14 Jul, 2023 - Comments: 0

SEMICON West returned in force this week, with a focus on AI and deep learning  in semiconductor manufacturing, security, heterogenous ICs, and the march toward a $1 trillion chip market. Lam Research President and CEO, Tim Archer, opened with the keynote presentation. Fig. 1: SEMICON West panel: AI’s influence on growth, China-U.S. trade war, and the importance of climate policy were... » read more

Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections
By Keith Best - 11 Jul, 2023 - Comments: 0

All great voyages must come to an end. Such is the case with our series on the challenges facing the manufacturing of advanced IC substrates (AICS), the glue holding the heterogeneous integration ship together. In our first blog, we examined how cumulative overlay drift from individual redistribution layers could significantly increase overall trace length, resulting in higher interconnect res... » read more

Using Advanced Analytics To Meet ESG Goals
By Mike McIntyre - 06 Jun, 2023 - Comments: 0

With the continued advancement of environmental, social and governance goals, corporations are increasingly focused on reducing their carbon footprints. To accomplish this, these companies are being asked to operate their businesses more efficiently than ever before, whether the matter is reducing waste, water usage or power consumption. This is true for the semiconductor industry as well. A... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips
By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

How Metrology Tools Stack Up In 3D NAND Devices
By Laura Peters - 15 May, 2023 - Comments: 0

Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the nonvolatile storage needs of the big data era. 3D NAND is the first truly three-dimensional device in production. It is both a technology driver for new metrology methods and a significant part of ... » read more

Addressing Yield Challenges In Advanced IC Substrate (AICS) Packaging
By Keith Best - 09 May, 2023 - Comments: 0

No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era is here, and it’s just beginning to have an impact on our lives, our jobs and our future. To meet the rigorous demands of AI – along with high-performance compute, 5G and electric vehic... » read more

Using AI To Improve Metrology Tooling
By Laura Peters - 17 Apr, 2023 - Comments: 0

Virtual metrology is carefully being added into semiconductor manufacturing, where it is showing positive results, but the chip industry is proceeding cautiously. The first use of this technology has been for augmenting existing fab processes, such as advanced process control (APC). Controlling processes and managing yield generally do not require GPU processing and advanced algorithms, so t... » read more

Using Machine Learning To Increase Yield And Lower Packaging Costs
By Melvin Lee - 11 Apr, 2023 - Comments: 0

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test (OSAT) houses have to spend more money, more time and more resources on assembly and testing. As such, one of the more important challenges facing OSATs today is managing die that pass testing at the ... » read more

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