Week In Review: Manufacturing, Test


Trade SEMI has voiced support and encouragement for trade discussions between U.S. President Donald Trump and the People's Republic of China President Xi Jinping. The talks are planned for Dec. 1 during the G20 Summit in Argentina. SEMI expressed hope for a deal and offered principles beneficial to the microelectronics supply chain. Recent tariffs and trade tensions, on top of rumored expor... » read more

Sorting Out Packaging Options


Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial T... » read more

Week In Review: Manufacturing, Test


Trade wars After opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, recently spoke out against an additional $16 billion in duties on Chinese goods. The tariffs do little to address U.S. concerns over IP loss, according to SEMI. Over the past month, SEMI has also submitte... » read more

The Week In Review: Manufacturing


Test and packaging In a major surprise, Cohu has entered into a definitive agreement to acquire Xcerra for approximately $796 million. With the deal, Cohu will enter the ATE market. Last year, a group from China entered into a definitive agreement under which it would acquire Xcerra. But the U.S. blocked Xcerra’s sale to the Chinese group. Ironically, at one time, Cohu was reportedly lobbyin... » read more

The Week In Review: Manufacturing


Trade wars China and the United States are in the midst of a trade war. Click here for the latest from CNN. Meanwhile, click here for a list of the winners and losers so far. Display Supply Chain Consultants, a research firm, provides more insights from a hi-tech perspective. Gary Shapiro, president and CEO of the U.S.-based Consumer Technology Association (CTA), issued a statement abo... » read more

TEL Sells Packaging Tool Unit


Tokyo Electron Ltd. (TEL) has signed a definitive agreement to sell its packaging equipment unit, TEL NEXX, to ASM Pacific Technology. With the proposed deal, ASM Pacific enters some new markets. ASM Pacific sells wire bonders, pick-and-place systems, leadframes and other products. Established in 2001, TEL NEXX sells electrochemical deposition (ECD) and physical vapor deposition (PVD) s... » read more

The Week In Review: Manufacturing


Trade President Trump this week announced his decisions on the actions the administration will take in response to China’s alleged unfair trade practices covered in the USTR Section 301 investigation of “China’s Acts, Policies, and Practices Related to Technology Transfer, Intellectual Property, and Innovation.” Trump has proposed import tariffs that amount to about $60 billion on pro... » read more

KLA-Tencor Buys Orbotech


In a move to expand into the process equipment and other new businesses, KLA-Tencor has entered into a definitive agreement to acquire Orbotech for approximately $3.4 billion. With the acquisition of Israel’s Orbotech, KLA-Tencor expands its efforts in the inspection and metrology markets. In addition, KLA-Tencor also enters into some new equipment fronts. Orbotech is involved in three... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

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