tag: ORNL

Technical Paper Roundup: November 14
By Liz Allan - 14 Nov, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=165 /] More Reading Technical Paper Library home » read more

CMOS-Based HW Topology For Single-Cycle In-Memory XOR/XNOR Operations
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “CMOS-based Single-Cycle In-Memory XOR/XNOR” was published by researchers at University of Tennessee, University of Virginia, and Oak Ridge National Laboratory (ORNL). Abstract: "Big data applications are on the rise, and so is the number of data centers. The ever-increasing massive data pool needs to be periodically backed up in a secure environment. Moreover, a ... » read more

Chip Industry Week In Review
By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Using Deep Learning to Secure The CAN Bus From Advanced Intrusion Attacks
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “CANShield: Deep Learning-Based Intrusion Detection Framework for Controller Area Networks at the Signal-Level” was published by researchers at Virginia Tech and others. "As modern vehicles become more connected to external networks, the attack surface of the CAN bus system grows drastically. To secure the CAN bus from advanced intrusion attacks, we propose a sig... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 25 Aug, 2023 - Comments: 0

The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027.  In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 30 Jun, 2023 - Comments: 0

Inflection AI raised $1.3 billion in a new funding round led by Microsoft, Reid Hoffman, Bill Gates, Eric Schmidt, and NVIDIA after raising $225 million in the first round to support the ongoing development of Pi, a “useful, friendly, and fun” AI. In partnership with CoreWeave and NVIDIA, Inflection aims to build the world’s largest AI cluster, comprised of 22,000 NVIDIA H100 Tensor Core ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 09 Jun, 2023 - Comments: 0

Apple uncorked its spatial computer, the Vision Pro, and a new operating system, the visionOS. The “infinite screen real estate” basically untethers the screen from the box, allowing users to work in multiple windows with no space limits. While the device garnered mixed reviews, largely based upon its $3,500 price tag, the implications of mixed-reality computing are potentially significant ... » read more

Stabilizing A Hafnium Oxide-Based Thin Film When Sandwiched Between A Metal Substrate And An Electrode
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A technical paper titled "Origin of Ferroelectric Phase Stabilization via the Clamping Effect in Ferroelectric Hafnium Zirconium Oxide Thin Films" was published by researchers at University of Virginia, Brown University, Sandia National Labs, and Oak Ridge National Lab. Funding was given by U.S. DOE's 3D Ferroelectric Microelectronics Energy Frontier Research Center and the SRC. "This study ... » read more

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