Week in Review: Manufacturing, Test

By Linda Christensen - 03 Jun, 2022 - Comments: 0

Hybrid Bonding & Supercomputers At this week’s ECTC conference, CEA-Leti and Intel presented an “optimized hybrid direct-bonding, self-assembly process," which they claim has the potential to increase alignment accuracy and speed up fab throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. “Commercial s... » read more

Technical Paper Round-up: April 26

By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

van der Waals Semiconductor Empowered Vertical Color Sensor

By Technical Paper Link - 20 Apr, 2022 - Comments: 0

Abstract "Biomimetic artificial vision is receiving significant attention nowadays, particularly for the development of neuromorphic electronic devices, artificial intelligence, and microrobotics. Nevertheless, color recognition, the most critical vision function, is missed in the current research due to the difficulty of downscaling of the prevailing color sensing devices. Conventional colo... » read more

Technical Paper Round-Up: March 29

By Linda Christensen - 29 Mar, 2022 - Comments: 0

Improving batteries, ultra low-power photonic edge computing, SLAM, Tellurium for 2D semiconductors, and reservoir computing top the past week's technical papers. The focus on energy is critical as the edge buildout continues and more devices are connected to a battery, while research into new architectures and materials that will continue scaling and improve performance per watt continue at th... » read more

SolidPAC is an interactive battery-on-demand energy density estimator for solid-state batteries

By Technical Paper Link - 27 Mar, 2022 - Comments: 0

Summary "Solid-state batteries hold the promise to be highly impactful next-generation technologies for high-energy and -power-density rechargeable battery applications. It is crucial to identify the metrics that an emerging battery technology should fulfill to achieve parity with conventional Li-ion batteries, primarily in terms of energy density. However, limited approaches exist today to as... » read more

Bell state analyzer for spectrally distinct photons

By Technical Paper Link - 27 Mar, 2022 - Comments: 0

Abstract "We demonstrate a Bell state analyzer that operates directly on frequency mismatch. Based on electro-optic modulators and Fourier-transform pulse shapers, our quantum frequency processor design implements interleaved Hadamard gates in discrete frequency modes. Experimental tests on entangled-photon inputs reveal fidelities of ∼98% for discriminating between the |Ψ+⟩ and |Ψ−⟩... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Power/Performance Bits: Feb. 18

By Jesse Allen - 18 Feb, 2020 - Comments: 0

Cryogenic memory Researchers at Oak Ridge National Laboratory demonstrated a new cryogenic memory cell circuit design based on coupled arrays of Josephson junctions. Such a memory could help enable exascale and quantum computing. The cells are designed to operate in super cold temperatures and were tested at just 4 Kelvin above absolute zero, about minus 452 degrees Fahrenheit. At these col... » read more

Power/Performance Bits: Jan. 28

By Jesse Allen - 28 Jan, 2020 - Comments: 0

Accelerator-on-chip Researchers at Stanford University and SLAC National Accelerator Laboratory created an electron-accelerator-on-chip. While the technique is much less powerful than standard particle accelerators, it can be much smaller. It relied upon an infrared laser to deliver, in less than a hair’s width, the sort of energy boost that takes microwaves many feet. The team carved ... » read more

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Knowledge Centers
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